Henkel CSP and BGA Underfills
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Henkel CSP and BGA Underfills |
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Henkel CSP and BGA Underfills Description:
Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance by redistributing stress away from the solder interconnects as well as enhancing mechanical performance. We have formulations that quickly fill very small gap/pitch parts, offer fast cure capabilities, have a long pot and shelf life, and are reworkable. Reworkability allows for cost savings by allowing the removal of the underfill to enable re-use of a board.
Flip-chip applications require assistance with redistributing stress away from the solder joints to extend thermal aging and cycle life. A CSP or BGA application requires an underfill to improve the mechanical integrity of the assembly during a bend, vibration or drop test. Henkel’s flip-chip underfills are formulated with a high loading of specialty fillers to achieve low CTEs yet maintain the ability to flow fast in small gaps, possessing high glass transition temperatures and high modulus. Our CSP underfills are designed with little to no filler loading, a choice of glass transition temperatures, and modulus to match the intended application.
For certain applications, Loctite Cornerbond and Edgebond technologies allow for cost-effective underfill solutions. The Cornerbond technology is applied at all four corners of the package and then can be cured during the normal solder reflow cycle, allowing for a more efficient process. The material’s self-centering characteristic ensures high assembly reliability and outstanding yield rates.
Henkel's CSP and BGA Underfill Products: |
Recommended Cure Schedule |
Viscosity |
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Package on Board - Capilary Flows - Reworkable: |
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Reworkable epoxy underfill for CSP and BGA packages. When cured offer excellent mechanical protection to solder joints. Compatible with most Pb-Free and Halogen solders. |
8 minutes @ 130ºC |
375 |
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A fast flow, low temperature, reworkable underfill. Very good impact and thermal cycle resistant performance. |
6 minutes @ 120°C |
2,200 |
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A single component, low viscosity, reworkable underfill allows filling in gaps under CSP BGA. |
15 minutes @150ºC |
3,000 to 6,000 |
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Originally designed as flip-chip underfill, proven workability at high |
10 minutes @ 100ºC |
2,000 to 4,500 |
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Underfill of chip scale and BGA package with rapid device throughput. Provide protection to solder joints against mechanical stresses. |
5 minutes @ 120ºC |
1,800 |
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Fast flow, low temperature cure, reworkable epoxy underfill designed to provide protection for solder joints against induced stress, increasing both drop test and temperature cycle performance of the device. |
5 minutes @ 120°C |
2,350 |
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Package on Board - Capilary Flows - Non-Reworkable |
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Fast cure at low temp high Tg underfill for temperature stable applications. |
3 minutes @ 135°C or 3 minutes @ 150°C |
17,000 |
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Filler filled nonreworkable, high reliability with 10 µm filler size. |
3.5 minutes @ 150ºC |
3,252 |
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Design for fine-pich WL-CSP having 35 µm gap or greater and requiring 260°C reflow resistance. |
20 minutes @ 150ºC |
6,500 |
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High speed, low temperature curing underfill for CSP and BGA. 1 |
7 minutes @ 160°C |
10,000 |
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Fast flow, fast cure high temp reliable underfill. |
5 minutes @ 165°C |
5,000 |
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Rapid curing, fast flowing, liquid epoxy designed for capillary flow underfill for chip size packages and where process speed is a key concern. Its rheology is designed to penetrate gaps as small as 25 μm. |
5 minutes @ 150 ºC or 3 minutes @ 165 ºC |
4,500 - 6,000 |
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Package on Board - Edgebonds - UV Cure |
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UV-cured adhesive designed for bonding electronics components on PCBs. Thixotropic nature reduces migration of product. Excellent adhesion to a wide range of substrates. Bonds in seconds upon exposure to UV light. |
UV Cured |
40,000 |
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Package on Board - Cornerbonds |
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Reworkable cornerfill is designed to cure during pb-free reflow while allowing self-alignment of IC components. It can be preapplied to the board at the corners of the pad site using a standard SMA dispenser. |
3 hours @ 180°C |
50,000 |
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Flip-Chip on Board - Capilary Flows |
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Designed for fine-pich WL-CSP having 35 µm gap or greater and requiring 260°C reflow resistance. |
20 minutes @ 150ºC |
20 minutes @150 ºC |
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Designed for capillary flow for thin gap (25 µm). |
30 minutes @ 165ºC |
5,000 |
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Low viscosity, fast flow flip-chip underfills for 75 micron gaps. Applicable for ceramic, organic and polyimide substrates. |
30 minutes @ 165ºC |
4,700 |
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A snap curable underfill for flip-chip on flex with 25 micron gap. Upon cure, it changes from blue to green. |
7 minutes @ 160ºC |
3,500 |
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A snap curable lower cte underfill for flip-chip for rigid laminate and ceramic. |
7 minutes @ 160ºC |
10,000 |
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Henkel CSP and BGA Underfills was added in Dec 2013
Henkel CSP and BGA Underfills has been viewed 3516 times
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