LOCTITE HF 212 Halogen-Free Solder Paste

LOCTITE HF 212 Halogen-Free Solder Paste Description:

Solder Paste for Medium and Large Board Assemblies

LOCTITE HF 212 solder paste is a halogen-free (no intended added halogen in formulation), no clean, low voiding Pb-free solder paste.

LOCTITE HF 212 also shows excellent solderability when reflowed in both air and nitrogen across a wide range of challenging surface finishes including immersion Ag, OSP-Cu, ENIG and CuNiZn.

LOCTITE HF 212 is suitable for use with industry standard SAC ,high reliability SAC and low silver alloys SAC.

• Halogen-free flux: passes IC with pretreatment IPC-TM-650 2.3.34/EN14582
• Halogen-free flux classification: ROL0 to ANSI/J-STD-004 Rev. B
• Printing: Fine pitch capability (0.3 mm), stencil life (>8 hours), and abandon time (>4 hours)
• Printing: Suitable for high speed printing up to 150 mm/s
• Reflow: Solderable on challenging surface finishes (CuNiZn and Copper OSP)
• Colorless residues for easy post-reflow inspection

Careful control of the atomisation process for production of solder powders for LOCTITE HF 212 solder pastes ensures that the solder powder is produced to a quality level that exceeds requirements for sphericity, size distribution, impurities and oxide levels. Minimum order requirements may apply to certain alloys and powder sizes. For availability contact your local technical service helpdesk.

All solder powders are RoHS compliant.

DIRECTIONS FOR USE

• Printing:
  • LOCTITE HF 212 is available for stencil printing with type Type 3 and Type 4 powder.
  • Printing at speeds between 60 and 150 mm/s can be achieved by using laser cut, electropolished or electroformed stencils and metal squeegees .
• Reflow:
  • Any of the available methods of heating to cause reflow may be used including IR, convection, hot belt, vapor phase and laser soldering.

Cleaning:

• LOCTITE HF 212 solder pastes are no-clean and are designed to be left on the PCB in many applications post assembly since it does not pose a hazard to long term reliability.
• Residue removal can be achieved using conventional cleaning processes based on solvents such as MCF800 or suitable saponifying agents.
• For stencil cleaning and cleaning board misprints, MULTICORE SC-01 Solvent cleaner is recommended.

RELIABILITY PROPERTIES

Solder Paste Medium:

LOCTITE HF 212 medium contains a stable resin system, slow evaporating solvents and with minimal odour. The formulation has been tested to the requirements of the ANSI/J-STD-004B for a type ROL0 classification specifications.

PACKAGING

Containers: LOCTITE HF 212 is supplied in:

• 500g plastic jars with an air seal insert
• 600g Semco cartridges