PCB & Semiconductor Packaging Materials.
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PCB & Semiconductor Packaging Materials. |
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PCB & Semiconductor Packaging Materials. Description:
Innovative Materials, Superior Performance.
Our printed circuit board and semiconductor packaging materials provide superior thermal and mechanical performance, a fact we’ve prided ourselves on for over 45 years. All our materials are RoHS compliant and UL approved. Many provide high thermal reliability and CAF resistance for lead-free assembly compatibility.
i3 produces all of this material in our very own Treater Tower, giving our customers a reduced time-to-market
Our featured electronic materials include:
| Circuitized Liquid Crystal Polymer. | Offering high density interconnection with proven reliability and performance. This circuitized laminate can be packaged with six or more layers. Radiation tolerant, and with a low dielectric constant and dissipation factor. |
| Polyimide Laminate. | i3’s Polyimide is an industry standard GPY equivalent polyimide and is used as a dielectric prepreg or a laminate in printed circuit board and laminate chip carrier fabrication. This material exhibits excellent performance in the field in a variety of high end applications, and is an ideal solution for the medical, aerospace and defense and computing markets. i3’s polyimide is also lead free compatible. |
| eXa Lam S® Laminate. | i3’s eXa Lam S® Laminate is a CAF free, high Tg, FR-4 epoxy resin used as a prepreg or laminate in printed circuit board construction. This time tested material has proven its reliability and performance in the field in a variety of high end applications. eXa Lam S® is available in a wide range of glass cloth styles and resin contents. |
| eXa Lam H® Laminate. | i3’s eXa Lam H® Laminate is a CAF free, high Tg, filled FR-4 epoxy resin used as a prepreg or laminate in printed circuit board construction. This material offers lower dissipation factor than standard eXa Lam at only a slight cost premium. i3’s eXa Lam H® passes all industry standard tests and offers robust no lead assembly performance. i3’s eXa Lam H® is available in a wide range of glass cloth styles and resin contents. |
| eXa Lam U® Laminate. | i3’s eXa Lam U® Laminate is a CAF free, high Tg, filled low loss thermo-setting resin used as a prepreg or laminate in printed circuit board con-struction. This material offers lower dissipation factor than standard eXa Lam at only a slight cost premium. i3’s eXa Lam U® passes all industry standard tests and offers robust no lead assembly performance. i3’s eXa Lam U® is available in a wide range of glass cloth styles and resin contents. |
| Black BT Laminate. | i3’s Black BT Laminate can be used as a low cost alternative to the current industry standard. This material provides improved electrical performance and excellent CAF resistance. i3’s Black BT laminate is available in a wide variety of cloth styles and resin contents. |
| eXa Lam® Silica Build Up. | Highly filled resin coated copper used to form redistribution layers in printed circuit boards or semiconductor packaging fabrication. |
| eXa Lam® Copper Paste Hole Fill. | i3’s eXa Lam® Copper Paste Hole Fill with high copper content reduces CTE mismatch and enhances thermal conductivity. eXa Lam® Copper Paste Hole Fill is applied using a special lamination process, resulting incomplete fill of high aspect ratio holes. |
| Silica Epoxy Hole Fill. | i3 Silica Epoxy is a non-conductive hole fill material containing i3’s eXa Lam® resin and amorphous silica. Silica Epoxy Hole Fill is applied via a lamination process, resulting in complete fill of high-aspect-ratio holes. |
PCB & Semiconductor Packaging Materials. was added in Dec 2005
PCB & Semiconductor Packaging Materials. has been viewed 634 times
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