i3 Electronics is a new breed of manufacturing company. Our vertically integrated business model enables us to provide a complete solution to our customers. From design and prototype all the way down to full system integration and test, i3 and our team of engineers, scientists and innovators are dedicated to providing our customers with the highest quality solutions that are unmatched by anyone in the world.
Here’s the kicker, we do it all from our North American manufacturing facility, reducing cycle times and ensuring a stream-lined and efficient manufacturing process.
We are leaders in:
- PCB FABRICATION
- 1ST & 2ND LEVEL ASSEMBLY
- SEMICONDUCTOR PACKAGING
- SYSTEM INTEGRATION & TEST
- ADVANCED LAB SERVICES
- CONTRACT R&D
- DESIGN, PROTOTYPE & QTA
- ADVANCED ELECTRONIC MATERIAL FABRICATION
We are a new company with a rich history. From our beginnings in 2013 as the successor to Endicott Interconnect Technologies, we have built a team of scientists, engineers, and innovators that are truly changing the electronics landscape.
Our technology can be found in the world's fastest supercomputers, life-saving medical devices, complex imaging systems, mission-critical defense applications and thousands of other products, throughout the world.
i3 Electronics Postings
Our design services – the total package. At i3, we are the premier supplier of leading-edge PCB and semiconductor package designs. We maintain a highly skilled team of design engineers with more than 170 years of c...
High Layer Count, High Complexity, High Reliability. At i3 Electronics, we offer the total package for your printed circuit board fabrication. We can design, manufacture, assemble, and test your PCB. Our specialty is high layer cou...
Aug 14, 2014 | Susan Bagen, Dave Alcoe, Kim Blackwell, Frank Egitto.
High reliability applications for high performance computing, military, medical and industrial applications are driving electronics packaging advancements toward increased functionality with decreasing degrees of size, weight and power (SWaP) The substrate technology selected for the electronics package is a key enabling technology towards achieving SWaP. Standard printed circuit boards (PWBs) utilize dielectric materials containing glass cloth, which can limit circuit density and performance, as well as inhibit the ability to achieve reliable assemblies with bare semiconductor die components. Ceramic substrates often used in lieu of PWBs for chip packaging have disadvantages of weight, marginal electrical performance and reliability as compared to organic technologies. Alternative materials including thin, particle-containing organic substrates, liquid crystal polymer (LCP) and microflex enable SWaP, while overcoming the limitations of PWBs and ceramic.
This paper will discuss the use of these alternative organic substrate materials to achieve extreme electronics miniaturization with outstanding electrical performance and high reliability. The effect of substrate type on chip-package interaction and resulting reliability will be discussed. Microflex assemblies to achieve extreme miniaturization and atypical form factors driven by implantable and in vivo medical applications are also shown....
May 05, 2011 | R. N. Das, K. I. Papathomas J. M. Lauffer, S. Rosser, M. D. Poliks, V. R. Markovich
Passives account for a very large part of today’s electronic assemblies. This is particularly true for digital products such as cellular phones, camcorders, and computers. Market pressures for new products with more features, smaller size and lower cost v...
Dec 22, 2010 | Rabindra N. Das, Varaprasad Calmidi, Mark D. Poliks and Voya R. Markovich
This paper discusses polymer based nanogels, nanofluids and nanopastes for thermal interface material (TIM) applications. Nanopaste and nanogel formulated using controlled-sized particles to fill small bond lines is highlighted....
Oct 28, 2010 | Benson Chan, How Lin, Chase Carver, Jianzhuang Huang, Jessie Berry
Optical waveguides based on organic materials have been fabricated in a laboratory environment but the scaling and manufacturing processes needed to produce these waveguides have been scant. The volume production of low loss organic waveguides in a conven...
Aug 05, 2010 | Bart O. McCoy, Robert Techentin, Benjamin Buhrow, Kevin Buchs, Dr. Barry K. Gilbert, Dr. Erik S. Daniel, How Lin
Variability analysis is important in successfully deploying multi-gigabit backplane printed wiring boards (PWBs) with growing numbers of high-speed SerDes links. We discuss the need for large sample sizes to obtain accurate variability estimates of SI me...
Oct 08, 2009 | Rabindra N. Das, Konstantinos I. Papathomas, Steven G. Rosser, Tim Antesberger, John M. Lauffer, Mark D. Poliks and Voya R. Markovich.
In the present study, we report novel ferroelectric-epoxy based polymer nanocomposites that have the potential to surpass conventional composites to produce thin film capacitors over large surface areas, having high capacitance density and low loss. Specifically, novel crack resistant and easy to handle Resin Coated Copper Capacitive (RC3) nanocomposites capable of providing bulk decoupling capacitance for a conventional power-power core, or for a three layer Voltage-Ground-Voltage type power core, is described....
Jul 22, 2009 | Varaprasad Calmidi, Irv Memis.
This paper deals with the thermal effects of joule heating in a high interconnect density, thin core, buildup, organic flip chip substrate. The 440 μm thick substrate consists of a 135 μm thick core with via density of about 200 μm. The typical feature sizes in the substrate are 50 micron diameter vias is the core/buildup layers and 12 micron thick metal planes. An experimental test vehicle is powered with current and the temperature rise was measured. A numerical model was used to simulate the temperature rise in the TV....
Apr 30, 2009 | Kevin Knadle.
This presentation surveys the most significant via and via-related laminate failure mechanisms from past to present using data from current induced thermal cycling (CITC) testing, failure analysis, and other sources. The relative life and failure modes of thru vias, buried vias, and microvias (stacked vs. non-stacked) are compared, along with the affect of structure, materials, and peak temperatures on the above. The origin of via-induced laminate failures such as "eyebrow cracks" and Pb free related internal delamination is also explored....
Jan 01, 2009 | Michael J. Rowlands and Vara Calmidi, Endicott Interconnect Technologiesogies
Recent technology advancement has enabled enhancement in PWB electrical performance and wiring density. These innovations have taken the form of improved materials, novel PWB interconnect structures, and manufacturing technology. One such advancement is Z-axis conductive interconnect. The Z-interconnect technology involves building mini-substrates of 2 or 3 layers each, then assembling several mini-substrates together using conductive paste....
Jun 25, 2008 | Endicott Interconnect Technologies, Inc.
Printing technologies provide a simple solution to build electronic circuits on o low cost flexible substrates. Nanocomposites will play important role for developing advanced printable technology. Advanced printing is relatively new technology and need more characterization and optimization for practical applications. In the present paper, we examine the use of nanocomposites or materials in the area of printing technology....
Dec 03, 2010 | Endicott Interconnect Technologies, Inc. (EI) announced today that the Company has added Liquid Crystal Polymer (LCP) Laminates to its family of microelectronics packaging product offerings.
Jul 08, 2008 | ENDICOTT, NY� Endicott Interconnect Technologies, Inc. President & CEO James J. McNamara Jr. has been named a recipient of the 2008 Ernst & Young Entrepreneur of the Year award in the advanced technology solutions category for the Upstate New York, Western Pennsylvania and West Virginia region.
Jun 19, 2008 | ENDICOTT, N.Y.� Congressman Michael Arcuri, representing New York�s people of the 24th district, visited Endicott Interconnect Technologies, Inc. (EI) on Thursday, May 29th, 2008. Also attending was Binghamton University President Lois DeFleur, who along with James McNamara, President and CEO of EI, highlighted the growing high-tech economy in the Southern Tier Region.
May 12, 2008 | Based on its recent analysis of the printed circuit board (PCB) markets, Frost & Sullivan recognizes Endicott Interconnect Technologies, Inc. with the North American Frost & Sullivan Award for Growth Excellence of the Year. The Award lauds Endicott for demonstrating excellence in manufacturing, revenue growth; dedication to customer service, and a well executed sales and marketing strategy.
May 12, 2008 | Microelectronics Manufacturing (CAMM) located at the Endicott Interconnect Technologies, Inc. facility was inaugurated on Monday, March 31st, in a ceremony attended by business, political and community leaders.
Feb 19, 2008 | Endicott Interconnect Technologies, Inc. (EI) announced today that it has fabricated an award winning, printed circuit board for IBM Zurich Research Laboratory (ZRL).
Feb 19, 2008 | Endicott Interconnect Technologies, Inc. (EI) announced today that they have again achieved platinum level status for surpassing the $100,000 mark in contributions to the United Way of Broome County for the fourth year in a row.
Jan 16, 2008 | Endicott Interconnect Technologies, Inc. (EI) announced today that it has fabricated an award winning, printed circuit board for IBM Zurich Research Laboratory (ZRL).
Jan 16, 2008 | Endicott Interconnect Technologies, Inc. (EI) has announced the appointment of Steven Burke to the position of chief financial officer for the company, a move that strengthens EI�s management team during a period of accelerating growth.
Jan 16, 2008 | Endicott Interconnect Technologies, Inc. (EI) has named Sharon Pinto to the position of vice president, human resources effective immediately.