Speedline Technologies, Inc.

Speedline Technologies serves the electronics assembly and semiconductor packaging industries with class-leading equipment, responsive support and unparalleled process knowledge.

Manufacturer of Assembly Equipment, Adhesives/Dispensing, Cleaning, Screen Printing, Soldering

Formed in 1998 as Speedline Technologies, has built a reputation as an industry innovator dedicated to the development and manufacture of product solutions for the electronics assembly and semiconductor packaging industries. Speedline is comprised of five best-in-class brands - ACCEL microelectronics cleaning equipment; CAMALOT dispensing systems; ELECTROVERT wave soldering, reflow soldering, and cleaning equipment; MPM stencil and screen printing systems; and PROTECT global services, support, and training solutions.

Speedline is part of the Specialty Systems Group within Illinois Tool Works, Inc. (NYSE:ITW), a global industrial company that operates 750 businesses located in 49 countries spanning the globe. The people of ITW develop thousands of engineered products and specialty systems serving diverse end markets and customer segments. Through direct partnerships with customers, ITW businesses maintain an environment of innovative leadership and continuous improvement.

Speedline Technologies, Inc. Postings

12 products »

MPM® Edison SMT Screen Printer

The MPM® Edison is an innovative new platform of next-generation printers sharing software, controls, and advanced technologies on a scalable platform. Featuring outstanding speed, accuracy, and performance surpassing best-in-...


MPM® Edison SMT Screen Printer

MPM Momentum Series SMT Stencil Printers

The Momentum family of printers takes a “no sacrifice” approach to printer performance. Offering an unparalleled price/performance ratio, the Momentum, Momentum+, Momentum Elite and Momentum HiE lead the industry in value. ...


MPM Momentum Series SMT Stencil Printers

MPM Accela Stencil Printer



MPM Accela Stencil Printer

ELECTROVERT VectraES ™ - SMT Wave Soldering System

The Ideal Wave Soldering System for Low-to-Medium Volume Lead-free Pproduction. The award-winning ELECTROVERT VectraES wave soldering system features exceptional system-wide accessibility, an advanced control system and innovative ...

Wave Soldering

ELECTROVERT VectraES ™ - SMT Wave Soldering System

ELECTROVERT VectraElite - SMT Wave Soldering System

The ELECTROVERT VectraElite is the wave soldering solution for medium to high volume production that requires fast changeover, process flexibility, and system reliability. The VectraElite combines innovative technology in an accessible platform...

Wave Soldering

ELECTROVERT VectraElite - SMT Wave Soldering System

ELECTROVERT Electra - SMT Wave Soldering System

The most advanced high-performance wave soldering system designed for high-volume manufacturing. Electra's proven performance has provided the electronics assembly industry with world-class soldering results. The Electra system...

Wave Soldering

ELECTROVERT Electra - SMT Wave Soldering System

ELECTROVERT OmniMax™ - SMT Reflow Oven Series

The OmniMax reflow soldering system is designed to deliver maximum thermal performance combined with process capability and control. IsoThermal™ Chamber Technology The OmniMax reflow soldering syst...


ELECTROVERT OmniMax™ - SMT Reflow Oven Series

ELECTROVERT OmniES™ - SMT Reflow Oven Series

The OmniES™ is proven to exceed lead-free profile requirements and delivers efficient high performance thermal processing. IsoThermal™ Chamber Technology The OmniES offers a combination of in...


ELECTROVERT OmniES™ - SMT Reflow Oven Series

ELECTROVERT Aquastorm - In-line Aqueous PCB Cleaning System

Unsurpassed cleaning, high-efficiency drying, low cost of ownership, ease of maintenance, and minimum down-time all come together in the ELECTROVERT Aquastorm, a world-class printed circuit board cleaning system. The Aquastorm seri...

Cleaning Equipment

ELECTROVERT Aquastorm - In-line Aqueous PCB Cleaning System

Camalot FX-D Solder Paste Dispenser

The Camalot FX-D is a cost-effective dispensing system that features a unique "plug and play" design. Available as a stand alone or in-line system, its wide array of available options can be easily configured in the field...


Camalot FX-D Solder Paste Dispenser

See all products from Speedline Technologies, Inc. »

12 technical articles »

Enclosed Media Printing as an Alternative to Metal Blades

Aug 06, 2015 | Michael L. Martel

Fine pitch/fine feature solder paste printing in PCB assembly has become increasingly difficult as board geometries have become ever more compact. The printing process itself, traditionally the source of 70% of all assembly defects, finds its process window narrowing. The technology of metal blade squeegees, with the aid of new materials, understanding, and settings such as blade angle, has kept pace with all but the smallest applications, e.g., 200μ - .50 AR and 150μ - .375 AR, which have been pushing blade printing technology to its limits.

Enclosed media print head technology has existed, and has been under increasing development, as an alternative to metal squeegee blade printing. Until recently, the performance of enclosed print heads had been comparable to the very best metal squeegees, but advances in enclosed print media technology have now made it a superior alternative to squeegee blades in virtually all applications....

Effect Of Squeegee Blade On Solder Paste Print Quality

Jun 17, 2010 | Rita Mohanty, Bill Claiborne; Speedline Technologies | Frank Andres; Cookson Electronics

The solder paste deposition process is viewed by many in the industry as the leading contributor of defects in the Surface Mount Technology (SMT) assembly process. As with all manufacturing processes, solder paste printing is subject to both special and common cause variation. Just like using graduated cylinders from distinctly different manufacturing processes to measure a volume of liquid, using different blades types can contribute significant special cause variation to a process. Understanding the significant differences in print performance between blade types is an important first step to establishing a standard blade for an SMT process....

Effect Of Board Clamping System On Solder Paste Print Quality

May 06, 2010 | Dr. Rita Mohanty; Speedline Technologies, Rajiv L. Iyer, Daryl Santos; Binghamton University

Stencil printing technology has come a long way since the early 80’s when SMT process gained importance in the electronics packaging industry. In those early days, components were fairly large, making the board design and printing process relatively simple. The current trend in product miniaturization has led to smaller and more complex board designs. This has resulted into designs with maximum area utilization of the board space. It is not uncommon, especially for hand held devices, to find components only a few millimeters from the edge of the board. The board clamping systems used in the printing process have become a significant area of concern based on the current board design trend....

Non-Contact Streaming Technology Enhances the Dispense Process

Sep 16, 2009 | Speedline Technologies, Inc.

The dispensing industry within electronics manufacturing represents a very diverse marketplace indeed; many different materials can be applied in many different ways. One high-growth area in this market is underfill, driven by the explosive demand for hand-held devices (HHDs). This segment is comprised of popular consumer goods, such as cell phones, mp3 players, GPS navigators, PDAs, portable games and ultra-mobile PCs. A new, non-contact dispense technology, known as Streaming, has recently been introduced to specifically address the incumbent needs associated with underfill....

Hybrid Drying Technology for In-line Aqueous Cleaning of Lead-Free Assemblies

Jan 21, 2009 | Dirk Ellis

This paper describes a new approach to drying circuit board assemblies that significantly reduces the cost of ownership of an aqueous cleaning system. Drying performance is increased through a hybrid drying process that reduces energy input, exhaust requirements and sound levels. The combination of high temperature blow-off and convection brings the flexibility to tailor drying performance to fit the product's drying requirements....

Broadband Printing - A Paradigm

Dec 03, 2008 | Arun S. Ramasubramanian, Dr. Daryl Santos; Suny Binghamton.

This paper presents the analysis from a recent printing study employing a test vehicle that includes components such as 01005s to QFPs. In a recent publication, part of this study was presented focusing on 01005 printing only. This printing process was determined to be suitable for 01005s assembly and also analyzed based on statistical capability. The current paper will present the results from additional detailed analysis to determine if this process has the capability to provide sufficient solder paste deposits for larger components located on the same test board. In the future, the SMT industry may always look towards “Broadband Printing” as an alternative to dual stencil or stepped stencil printing technologies in order to meet the needs of both small and large components....

Effect of Contact Time on Lead-Free Wave Soldering

Aug 28, 2008 | Jim Morris, Richard Szymanowski

The increasing use of lead-free solder has introduced a new set of process parameters when setting up wave solder equipment for effective soldering. Determining the proper flow characteristics of the solder wave for adequate hole fill is an essential step in achieving a reliable process. A variety of solder waves exist in the industry; each with advantages and disadvantages when performing lead-free wave soldering. One way to ensure adequate hole-fill is by increasing contact time at the Chip Wave....

Solder Paste Inspection Technologies: 2D-3D Correlation

May 28, 2008 | Rita Mohanty, Vatsal Shah; Speedline Technologies, Paul Haugen, Laura Holte; Cyber Optics Corp.

This paper describes correlation between a true 2D area measurement (e.g. printer) and a height map generated area from a SPI system. In addition, this paper will explore the correlation between area/volume measurements and bridge detection between 2D/3D techniques. The ultimate goal is to arm the process engineers with information that can be used to make decision that will impact defects, cost, throughput and Return On Investment....

Flux Collection and Self-Clean Technique in Reflow Applications

May 14, 2008 | Speedline Technologies, Inc.

This paper will review some basic past and present flux chemistries that affect flux collection methodology. It will also review some of the most common flux collection methods, self-cleaning techniques, and maintenance goals. And, finally, data will be presented from high volume production testing of an advanced flux management system....

Liquid Tin Corrosion and Lead Free Wave Soldering

Feb 12, 2008 | Jim Morris, Speedline Technologies, Matthew J. O’Keefe, Ph.D., University of Missouri

Corrosion of solder pots and solder pot components in wave soldering equipment has been reduced with the introduction of corrosion resistant coatings and improved lead free solder alloys. The latest trends in protecting wave solder machine components from liquid metal corrosion by lead free solder alloys will be presented in order to provide guidelines for evaluating existing equipment as well as for purchasing new systems....

2 more technical articles from Speedline Technologies, Inc. »

19 news releases »

TopLine’s Micro-coil Springs (MSC) for CCGAs in Harsh Environments Featured at IPC/APEX EXPO 2017

Jan 29, 2017 | TopLine will exhibit its MSC Series of Micro-coil springs, a novel interconnect for CCGA (Ceramic Column Grid Array) IC packages for harsh environments. In tests using daisy chain test vehicles, Micro-coil springs absorbed extreme shock of up to 50,000g before failing. Commercial applications include aerospace, avionics, military, down-hole oilfield drilling and automotive electronics. Test results were initially presented at IEEE CPMT 2012.

ITW EAE Introduces MPM 100 Printer to Meet Market Demand for Reduced Cost

Jan 25, 2017 | MPM printers have a reputation for being fast, precise, and highly reliable, with performance unmatched by any other printer in their class. The New MPM 100 brings the quality and performance expected from MPM at a reduced price.

Speedline MPM Edison Printer Takes an Impressive New Product Introduction Award at APEX 2016

Mar 31, 2016 | Speedline MPMs' new Edison printer received the 2016 New Product Introduction (NPI) award in the stencil/screen printing equipment category. Announced by Circuits Assembly at the recent IPC APEX® trade event in Las Vegas, winners were recognized for leading new products in electronics assembly equipment, materials and software.

Speedline Displays New Technologies at APEX 2016, MPM, Electrovert, and Camalot Products

Feb 24, 2016 | Coming off a highly successful global launch at Productronica in November, the MPM Edison printing system makes its North American debut at this year's Apex show. As the next generation in printing technology, with patented features throughout its design, the Edison operates at twice the speed and with 25% more accuracy than other printers. With an all new highly-efficient parallel processing stencil shuttle system, wiper, vision gantry, the Edison is capable of reducing your total cycle time by as much as 15 seconds as compared to competitive printers (includes stencil wipe and printing).

Speedline Technologies’ MPM Edison Printer Takes Prestigious Global Technology Award at Productronica 2015

Nov 18, 2015 | Speedline Technologies’ new MPM Edison printer has taken a coveted Global Technology Award. The award was presented to Speedline Technologies’ Mark Clemons, Business Unit Manager – Printers, during a ceremony on Tuesday, Nov. 10, 2015 that took place at the Messe München exhibition center in Munich, Germany during Productronica.

Speedline Launches MPM® Edison Next Generation Printer Platform

Oct 27, 2015 | Speedline Technologies announces the introduction of MPM Edison, the next generation in printing technology. Edison is an innovative new platform of next-generation printers sharing software, controls, and advanced technologies on a scalable platform.

Speedline's Isaiah Smith to Present at SMTAI 2014; PCB Assembly Solutions also to be Exhibited.

Aug 22, 2014 | Speedline Technologies will exhibit PCB assembly technology solutions, including an MPM Momentum printer and Electrovert Aquastorm 50 Batch Cleaner, in Booth #637 at SMTA International 2014. Speedline's Isaiah Smith, Senior SMT Printing Application – Sales Engineer, will also present "Advances in Fine Pitch Printing Process Technology" in the Technical Conference.

Free PCB Cleaning and Reliability Workshop Planned Sept. 9 in Guadalajara

Aug 06, 2014 | Speedline Technologies' Electrovert division will host a free PCB cleaning and reliability workshop in Guadalajara, Mexico, together with Kester and Zestron. The entire workshop will be presented in the Spanish language.

Speedline Launches New Electrovert® Electra™ Next Generation Wave Soldering System

Jun 12, 2014 | The new Electrovert® Electra™ by Speedline Technologies® is the "Next Generation" in wave soldering systems, offering innovative new features and enhanced performance that make it the most ‘state-of-the-art’ wave soldering system to be launched into the marketplace to date, according to Geoff Klein, Electrovert's General Manager.

Speedline Launches Space-Saving MPM® Momentum® BTB (Back to Back) Printers for Dual Lane Configuration

Apr 30, 2014 | SMT electronics assemblers can nearly double their stencil printing throughput without doubling their machine footprint with the new MPM Momentum BTB (Back to Back) printer.

9 more news releases from Speedline Technologies, Inc. »

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