SMT Equipment

X3 3D X-Ray - Automated In-line X-Ray Inspection System

X3 3D X-Ray - Automated In-line X-Ray Inspection System

X3 3D X-Ray - Automated In-line X-Ray Inspection System

Name:

X3 3D X-Ray - Automated In-line X-Ray Inspection System

Category:

Inspection

Offered by:

Nordson YESTECH

Company Information:

Nordson YESTECH

Nordson YESTECH is a leading global provider of automated optical inspection and high-resolution x-ray inspection systems.

Carlsbad, California, USA

Inspection

  • Phone 760-918-8471
  • Fax 760-918-8472

Nordson YESTECH website

Company Postings:

(9) products in the catalog

(2) technical library articles

(33) news releases

X3 3D X-Ray - Automated In-line X-Ray Inspection System Description:

  • Automated 2D & 3D inspection
  • Unsurpassed image quality
  • High defect detection
  • Low false calls
  • Fast throughput
  • Quick set-up

Nordson YESTECH's versatile X3 Automated X-Ray Inspection Systems (AXI) offers complete inspection of solder joints and other critical hidden features found in electronic assemblies, PCBs and packaged semiconductors. Ideal for in-line or off-line operation, the X3's innovative algorithms enable fast and reliable automated inspection and real-time monitoring of critical process information.

Programming is fast and intuitive. Nordson YESTECH’s state of the art,patented Digital Tomosynthesis Technology aquires multiple images in different slice heights in one inspection cycle.The images can discriminate between components on the top and bottom slices ofdouble sided boards for unimpeded automated inspection.

The utilization of standard package libraries simplify training and ensure program portability across manufacturing lines. Newly available image processing technology integrates several techniques and inspection algorithms, to provide complete inspection coverage with an extremely low false failure rate.

When integrated with Nordson YESTECH AOI inspection, these systems can increase fault coverage to include nearly all process defects. Optional remote programming and SPC software can be utilized to provide a comprehensive yield enhancement solution.

Modes: 2D and 3D operation
Throughput: 4 to .5 sq. in./sec
Maximum Board Size: Up to 20”” x 18”” (508mm x 450mm)
Clearance: Up to 2”” (50mm) top and 1”” (25mm) bottom
Minimum Component Size: 01005
Defects Detected: Part: position, missing, wrong, skew, tombstone
Lead: bent, lifted, bridging
Solder: open, insufficient, short, solder balls
BGA: shorts, voids, position, missing ball

X3 3D X-Ray - Automated In-line X-Ray Inspection System was added in Dec 2011

X3 3D X-Ray - Automated In-line X-Ray Inspection System has been viewed 822 times

8 More Products from Nordson YESTECH :

Online IPC Training & Certification

SMT spare parts - Qinyi Electronics