Synova S.A.

Synova is an experienced manufacturer of innovative laser cutting systems for an extraordinary range of micro-machining and dicing applications.

Manufacturer of Assembly Equipment

The company�s proprietary Laser MicroJet� (water- jet-guided laser) is rapidly emerging as the ideal solution for addressing the exacting manufacturing specifications and low cost-of-ownership requirements associated with volume production of today�s advanced electronic devices and other micro-machining applications.

With this unique technology, the laser beam is guided practically loss-free inside a hair-thin, low-pressure water jet by total reflection at the air/water interface. This revolutionary process allows unsurpassed cutting quality � far superior to that of traditional lasers � while avoiding heat damage, deposition and material changes.

Synova�s state-of-the-art machines are available in manual, semi-automatic or fully automatic versions. These high-precision cutting systems, featuring our proprietary Laser MicroJet� technology, perform fast, accurate, omni-directional cutting with no chipping, burrs, deposition, contamination, thermal damage, material changes or mechanical stress. Our tools have been repeatedly field proven and are used for 24-hour-a-day industrial production.

Synova S.A. Postings

4 products »

Laser Cutting Systems

The LCS 300 has a working area of 300 x 300 mm and is suited for various applications, such as cutting, drilling, grooving of any material. The LCS is manually loaded, and includes an automatic work piece vision alignment system. The work piece is fi...

Laser Cutting Systems

Laser Stencil Systems

The LSS is especially suited for high-precision cutting of stencils and metal masks. The large working area allows the cutting of any stencil size. The machine has a Gerber interface and the data can be automatically transferred to the NC co...

Laser Stencil Systems

Laser Grinding Systems

The Laser Microjet� grinding system is suitable for grinding, drilling and slotting of wafers. It provides excellent capabilities for the removal of micro-cracks on the wafer edge. For more information please visit our website...

Laser Grinding Systems

LDS � Laser Dicing Systems

The LDS 200 A is a fully automatic, cassette-to-cassette machine including fast quality check (control of kerf width, position and roughness). For more information please visit our website...

LDS � Laser Dicing Systems
Benchtop Fluid Dispenser

SMT assembly factors