Thin Core Copper Clad Laminate FR4 & Prepreg

Company Information:

Mica-AVA (Far East) Industrial Ltd (MAF) cooperate with Hitachi Chemicals manufactures high reliability, high-quality and quick-turn laminate FR4 products (Normal, High Tg and Halogen free)

Hong Kong, China

Manufacturer

852-26601414
852-26601920

See Supplier Website »

Company Postings:

(2) products in the catalog

Name:	Thin Core Copper Clad Laminate FR4 & Prepreg
Offered by:	Mica-AVA (Far East) Industrial Ltd

Thin Core Copper Clad Laminate FR4 & Prepreg Description:

Copper Clad Laminate FR4 & Prepreg Suitable for HDI and high layer count PCB fabricator High Tg (> 170 oC) Phenolic cured (Dicy Free) system with inorganic filler High Td (decomposition temp. > 340 oC by TGA) Lead free process compatible (260 oC IR reflow 6x + 288 oC solder flow 3x, no delamination) Low Coefficient of Thermal Expansion (< 2.8% from 50 �C 260oC) High heat resistance demonstrated by T-260, T-288 and T-300 T-260 > 60 min. T-288 > 20 min. T-300 > 10 min. Over 15 cycles by thermal stress 288 oC and 310 oC, 10 sec solder float. Anti-CAF > 1000 hrs Prepreg: 1080, 2116, 7628, 106, 3313, 1501

Thin Core Copper Clad Laminate FR4 & Prepreg was added in Mar 2007

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