Lead Free Technology For Electronic Assemblies Problems and Promises

Lead Free Technology For Electronic Assemblies Problems and Promises Description:

Transition to Lead free will impact almost everyone in the electronics industry whether you consider yourself RoHS exempt or not. This is not a theoretical course. The objective of this course is to show you how you can resolve the business and technical issues (principles as well as practice) for an effective implementation of lead-free at lower cost and higher yield. Most lead-free solders have higher melting points than currently used tin-lead solders and thus pose a challenge for all board assembly processes, including rework. As opposed to one tin-lead composition we have been used to, in lead free you may have to deal with multiple lead free BGA ball compositions with different melting point on the same board. Lead free will impact almost everyone in the electronics industry - from suppliers of components, boards and materials like paste and flux, to manufacturers and users of electronics products and equipment. We will discuss the details of RoHS and WEEE legislation including China RoHS and the status of exemptions for various industries.

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