SMT Equipment

AW-105R Plasma Asher Descum Equipment

Company Information:

Professionally provide RTP, PLasma Asher,Descum,Etcher, Sputter deposition, Metal thin film thickness measurement equipment made in U.S.A.

Morgan Hill, California, USA

Manufacturer

  • Phone 001-408-778-7788
  • Fax 001-408-9047168

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Company Postings:

(12) products in the catalog

AW-105R Plasma Asher Descum Equipment

AW-105R Plasma Asher Descum Equipment

Name:

AW-105R Plasma Asher Descum Equipment

Offered by:

Allwin21 Corp.

   

AW-105R Plasma Asher Descum Equipment Description:

sales@allwin21.com

The AW-105R single-wafer photoresist asher and descum is an automated tool designed as a flexible 13.56MHz RF Parallel Plate plasma photoresist removal and descum system for high-volume wafer fabrication. The AW-105R is in direct response to manufacturer’s concerns for wafer uniformity, uptime, reliability and production-proven technology.

Key Features:

  1.           Production-proven plasma Asher/Descum system.
  2.           Integrated solid robotic wafer handling, Single wafer process.
  3.           Up to 3%-5% Uniformity. Best for III-V Materials.
  4.           Frontside and backside isotropic removal.
  5.           Consistent wafer-to-wafer process cycle repeatability.
  6.           Element heating for up to 250oC.
  7.           50mm-150mm wafer capability. Up to 6.25” substrate.
  8.           Up to 4 wafer size capability without hardware change.
  9.           Fixed cassette station and wafer aligner/cooling station.
  10.           Can handle 50um thickness wafer.
  11.           PC controller with Advanced Allwin21 Software.
  12.           Endpoint detection (EOP) with Allwin21 SLOPE technology (Optional).
  13.           Up to 3 gas lines with MFC.
  14.           Air-Cooled 600W MKS 13.56 MHz RF Generator (300W Option).
  15.           Pressure control with Throttle Valve.
  16.           15-inch Touch screen monitor GUI.
  17.           EMO, Interlocks, and Watchdog function.
  18.           GEM/SECS II (optional).
  19.           Small Footprint: 27”W x 40”D x 59”H   (280LBs)
  20.           Made in U.S.A.

Specifications:

  1. Wafer Size: Up to 6.25 inch.
  2. Temperature: 60-250ºC (±2ºC)
  3. Gas Lines: Up to three gas lines with MFCs.

Typical MFC configuration: 5 SLM O2 and 500 SCCM N2.

  1. Asher Rate: 0.5-1.5 um/min at 200 to 250 ºC, bulk strip; 600 A/min at 100 ºC, Descum
  2. Uniformity: <±8% (Max-Min) Strip; <±5% (Max-Min) Descum
  3. Particulate: <0.05 /cm2 (0.03um or greater)
  4. Damage: CV:<0.1V from control; Mobile Ion:<1-2 E10 ; Vt :0% total shift on 98% of points tested no shift >5%
  5. Selectivity: >1000:1
  6. MTBF/MTTA/MTTR: 450 Hours/100 Hours/3.5 Hours or Better.
  7. 95% uptime

*Contact Allwin21 sales for other applications and specifications

sales@allwin21.com

AW-105R Plasma Asher Descum Equipment was added in Sep 2007

AW-105R Plasma Asher Descum Equipment has been viewed 208 times

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