SMT Equipment

FINEPLACER® pico ma - Multi-purpose Bonder

Company Information:

Finetech manufactures innovative, high-accuracy equipment for leading-edge bonding, micro assembly and rework challenges.

Gilbert, Arizona, USA

Manufacturer

  • Phone +1 480 893-1630
  • Fax +1 480 893-1632

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FINEPLACER® pico ma - Multi-purpose Bonder

FINEPLACER® pico ma - Multi-purpose Bonder

Name:

FINEPLACER® pico ma - Multi-purpose Bonder

Category:

IC Packaging

Offered by:

Finetech

   

FINEPLACER® pico ma - Multi-purpose Bonder Description:

A multi-purpose bonder, offers high placement accuracy (5 micron), allowing for bonding of the smallest die with a pitch of down to 50 µm.

This versatile platform is used in a wide field of micro assembly applications – such as flip chip and die bonding. Designed for prototyping or low-volume production, R&D and universities.

Highlights

  • Placement accuracy up to 5 µm*
  • Components from 0.125 x 0.125 mm² to 100 x 100 mm²*
  • Working area up to 450 x 122 mm² *
  • Supports wafer/substrate sizes* up to 8"
  • Supports bonding forces up to 400 N*
  • Can be configured as a hot air rework system
  • Manual and semi-automatic configurations

* depending on configuration and application


FINEPLACER® systems

The modular FINEPLACER® systems offer maximum process flexibility in many different connection technologies. They include a wide variety of soldering and bonding technologies, as well as ultrasonic and thermal compression bonding. FINEPLACER® systems are used especially in R&D, prototype building and small series production.

FINEPLACER® pico ma - Multi-purpose Bonder was added in Mar 2011

FINEPLACER® pico ma - Multi-purpose Bonder has been viewed 1450 times

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