FINEPLACER® pico ma - Multi-purpose Bonder

FINEPLACER® pico ma - Multi-purpose Bonder Description:

A multi-purpose bonder, offers high placement accuracy (5 micron), allowing for bonding of the smallest die with a pitch of down to 50 µm.

This versatile platform is used in a wide field of micro assembly applications – such as flip chip and die bonding. Designed for prototyping or low-volume production, R&D and universities.

Highlights

• Placement accuracy up to 5 µm*
• Components from 0.125 x 0.125 mm² to 100 x 100 mm²*
• Working area up to 450 x 122 mm² *
• Supports wafer/substrate sizes* up to 8"
• Supports bonding forces up to 400 N*
• Can be configured as a hot air rework system
• Manual and semi-automatic configurations

* depending on configuration and application

FINEPLACER® systems

The modular FINEPLACER® systems offer maximum process flexibility in many different connection technologies. They include a wide variety of soldering and bonding technologies, as well as ultrasonic and thermal compression bonding. FINEPLACER® systems are used especially in R&D, prototype building and small series production.