FINEPLACER lambda - Flexible Sub-micron Die Bonder

FINEPLACER lambda - Flexible Sub-micron Die Bonder Description:

The FINEPLACER® lambda is a flexible sub-micron bonder used for precise placement, die attach and advanced packaging. The system offers outstanding flexibility with a modular design and can be easily reconfigured for different applications.

The system offers outstanding flexibility with a modular design and can be easily reconfigured for different applications. It is the ideal choice for low volume production, prototyping, education and R&D where process flexibility is the key.

This cost- effective die bonder handles a wide range of sophisticated processes, including Indium bonding as well as extremely sensitive materials such as GaAs or GaP.

FINEPLACER lambda Highlights:

• Sub-micron placement accuracy
• Unique optical resolution
• Handles ultra small components
• Special tools allow object sizes down to 5 µm*
• Supported substrate size up to 6" *
• Closed loop force control*
• Small footprint and compact design
• Optics movement with programmable positions

FINEPLACER lambda Features:

• Automated processes
• Overlay vision alignment system (VAS) with fixed beam splitter
• Robust construction and modular design
• Integrated Process Management (IPM)
• Real time process observation camera
• Adaptive process library
• Process transfer from system to system
• Virtually unlimited range of advanced bonding technologies

FINEPLACER lambda Benefits:

• Hands-off die placement, user independent process operation
• Outstanding placement accuracy and instant operation without adjustments
• Provides high level of reproducibility and application flexibility
• Synchronized control of all process related parameters: force, temperature, time, flow, power, process environment, light and vision
• Immediate visual feedback reduces process development time
• Fast and easy process development
• Process transfer from R&D to production saves time, guarantees reliable results
• ROI savings - one machine for all applications

FINEPLACER lambda Technologies:

• Thermocompression
• Thermosonic
• Ultrasonic
• Soldering (AuSn, C4, Indium, eutectic)
• Adhesive technologies
• Curing (UV, thermal)
• Mechanical assembly

FINEPLACER lambda Applications:

• Laser diode, laser bar bonding
• VCSEL, photo diode assembly
• LED bonding
• Micro optics assembly
• MEMS packaging
• Sensor packaging
• 3D packaging
• Wafer level packaging (W2W, C2W)
• Chip on glass, chip on flex
• Flip chip (face down)
• Precise die bonding (face up)

Technical Specifications:

• Placement accuracy: ± 0.5 µm
• Field of view (min)1: 0.4 mm x 0.3 mm
• Field of view (max)1: 6 mm x 4.5 mm
• Component size (min)1: 0.1 mm x 0.1 mm
• Component size (max)1: 15 mm x 15 mm
• Theta fine travel: ± 5°
• Z-travel: 10 mm
• Working area1: 190 mm x 52 mm
• Bonding force range2*: 0.1 N - 400 N
• Heating temperature (max)1,2*: 400 °C

* depending on configuration/application
1 standard value, other values on request
2 optional module

FINEPLACER® systems

The modular FINEPLACER® systems offer maximum process flexibility in many different connection technologies. They include a wide variety of soldering and bonding technologies, as well as ultrasonic and thermal compression bonding. FINEPLACER® systems are used especially in R&D, prototype building and small series production.