FINEPLACER pico rs - High Density SMT Rework Station

FINEPLACER pico rs - High Density SMT Rework Station Description:

FINEPLACER® pico rs is an enhanced hot air rework station for assembly and rework of all types of SMD components.

The system is a best seller for professional mobile device rework in high density environments. A high level of process modularity allows all rework process steps within one system. The FINEPLACER® pico rs system is at home in R&D, process development, prototyping and production environments.

Application area from 01005 up to large BGA on small to medium sized PCBs, with the goal to have highly reproducible soldering results.

Highlights

• Industry-leading thermal management
• Components from 0.125 mm x 0.125 mm to 90 mm x 70 mm
• Board sizes up to 400 mm x 234 mm
• High efficiency board heater
• Closed loop force control
• Automated top heater calibration
• Placement accuracy better than 5 µm

Features

• Automated soldering processes
• Overlay vision alignment system (VAS) with fixed beam splitter
• Modular design
• Integrated Process Management (IPM)
• Real time process observation camera
• Adaptive process library
• Process transfer from system to system

Benefits

• Hands-off component placement, user independent process operation
• Outstanding placement accuracy and instant operation without adjustments
• Provides high level of application flexibility
• Synchronized control of all process related parameters: force, temperature, time, flow, power, process environment and illumination
• Immediate visual feedback reduces process development time
• Fast and easy process development
• Identical results on different machines allow central profile development,administration and distribution

Processes

• Component removal
• Site cleaning
• Re-balling (array, single)
• Paste printing (component, PCB)
• Paste dipping
• Paste dispensing
• Fluxing
• Soldering
• Desoldering

Applications

• Soldering of:
  • BGA, µBGA/CSP, QFN, DFN, PoP, QFP, PGA, SON
  • Small passives down to 01005
  • RF shields, RF frames
  • Connectors, sockets
  • Sub assemblies, daughter boards
  • Flip Chip (C4)
• Pin in Paste (PiP)
• Trough Hole Reflow (THR)
• Reworkable underfill, conformal coating
• Single ball rework

FINEPLACER® systems

The modular FINEPLACER® systems offer maximum process flexibility in many different connection technologies. They include a wide variety of soldering and bonding technologies, as well as ultrasonic and thermal compression bonding. FINEPLACER® systems are used especially in R&D, prototype building and small series production.