High Force ACF Bonder

High Force ACF Bonder Description:

Bonding forces up to 700 N with outstanding coplanarity.

As the versatile FINEPLACER® pico ma system continues to evolve, a new optional configuration has been developed for the latest Anisotropic Conductive Film (ACF) applications.

Today's ACF challenges are often characterized by enlarged bond areas and multi chip settings. Therefore, the machine's mechanical structure was reinforced to provide extra sturdiness and the ability to apply higher bonding forces. A novel 700N Bonding Force Module as well as a new Multi-Chip Transfer Station were integrated into the new setup to complement the Precision z-Hub Positioning Table for high forces as well as the ACF Module.

With a FINEPLACER® pico configured for ACF applications, up to 4 components can be placed simultaneously and bonded with defined distances of only a few microns. Applied bonding forces of up to 700 N while maintaining outstanding tool coplanarity ensure a coherent and durable bond between chips and Anisotropic Conductive Films.

Highlights

• Placement accuracy 5 µm*
• Components from 0.125 x 0.125 mm2 to 40 x 40 mm2 *
• Working area up to 450 mm x 122 mm*
• Supports wafer/substrate sizes* up to 8" *
• Supports bonding forces up to 700 N*
• Outstanding tool coplanarity over the complete force range
• Manual and semi-automatic configurations
• Quick Chip Heating Module allowing temperature ramps up to 20 K/s
• Substrate Heating Module with heated area of 50 x 50 mm² and temperature ramps up to 20 K/s
• Multi-Chip Transfer Station with separate vacuum switching

Features

• Automated processes
• Overlay vision alignment system (VAS) with fixed beam splitter
• Real time process observation camera
• Quick temperature processes
• Multi-chip handling
• Integrated ACF support, suitable for non-transparent ACF
• Pneumatic Bonding Force Module up to 700 N

Benefits

• Automated die pick-up and placement of chips
• High-precision chip placement with defined distances, realized via transfer station with glass mask
• Synchronized temperature and force processes
• Integrated ACF tool with heating function
• Optics shifting for alignment of long chip edges
• Outstanding placement accuracy
• Quick and easy process development

Applications

• Multi-Chip Assembly
• FlipChip Assembly
• Chip-on-Flex (COF)
• Chip on Board (COB)
• VCSEL/ Photo Diode Bonding
• Sensor Packaging
• ... and more