SMT Equipment

AWPb 300 Fully Automated Wafer Printing / Bumping System

Company Information:

The Company is dedicated to the development, manufacturing, servicing and/or licensing of manual, semi automatic and automatic stencil/screen printers, dispensers, and wafer printers for the Surface Mount Technology (SMT) and Semiconductor Industries

Medway, Massachusetts, USA

Manufacturer

  • Phone 508.533.5322
  • Fax 508.533.8686

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Company Postings:

(4) products in the catalog

(23) news releases

AWPb 300 Fully Automated Wafer Printing / Bumping System

AWPb 300 Fully Automated Wafer Printing / Bumping System

Name:

AWPb 300 Fully Automated Wafer Printing / Bumping System

Offered by:

Milara Inc

   

AWPb 300 Fully Automated Wafer Printing / Bumping System Description:

» Fully automated 200 / 300mm EFEM wafer capability

» Patented vibration squeegee technology

» Dual or Single load port available

Milara takes its combined system technology practice one step further with the development of the new AWPb 300 Wafer Printer / Bumper system. It is capable of handling 150, 200 and 300mm wafers with either a dual or single FOUP option. A single robotic arm with pre-aligner is used to load and unload wafers onto the automated print stage (EFEM). Utilizing our patented vibration squeegee technology which has proven viability in wafer bumping, the AWPb 300 employs the same technology used by all Milara printers to accomplish ultra fine pitch printing (down to 38um) with 100 percent printing reliability in conjunction with unsurpassed solder brick geometry.

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AWPb 300 Fully Automated Wafer Printing / Bumping System was added in Nov 2007

AWPb 300 Fully Automated Wafer Printing / Bumping System has been viewed 152 times

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