Kimball Electronics, Inc.

Kimball Electronics offers complete product life cycle support for electronic manufacturing assemblies in the Medical, Industrial, Automotive, and Public Safety market segments.

Contract Manufacturer

Kimball Electronics was established in 1961 as the Jasper Electronics Manufacturing Company to build electronic organs for our then parent company, Jasper Corporation. Jasper Corporation later became Kimball International. During the late 1960's contract manufacturing began with the first Industrial contract from General Electric Appliances of Louisville, KY. As the electronics industry evolved, and Kimball expanded, Kimball Electronics did as well.

During the 1980's we became focused solely on contract electronic manufacturing services and expanded into the Automotive, Medical, and Public Safety markets and eventually became known as Kimball Electronics Group. Since that time, it has been our mission to be a worldwide Electronics Manufacturing Service Industry leader in providing superior services and technology while growing profitably. On October 31, 2014, Kimball Electronics was spun-off from parent company Kimball International and became a publicly traded company on the NASDAQ Global Select stock exchange under the Kimball Electronics name and symbol KE.

Today, Kimball Electronics is a leading contract manufacturer of durable goods electronics serving a variety of industries on a global scale. Kimball Electronics continues to make the customer the focus of everything we do and will continue to provide the highest industry quality through continuous improvement.

Kimball Electronics, Inc. Postings

2 technical articles »

Using Lean Six Sigma to Optimize Critical Inputs on Solder Paste Printing

Mar 21, 2018 | Tom Watson

Solder paste printing is the first step in the surface mount manufacturing process for PCBA assembly. When the solder paste printing process is uncontrolled, defects can be produced, which may not become apparent until the PCBA is downstream. (...)

This paper will discuss how Lean Six Sigma techniques were used to optimize the solder paste printing process. It will highlight how a cross-functional team used the structured Define, Measure, Analyze, Improve and Control (DMAIC) methodology to identify and control the critical inputs. The advantage of the Lean Six Sigma methodology is that it guides the team through the rigorous structured process so that all possible inputs are considered and the critical ones can be identified....

Re-Shoring or Near-Shoring Concepts Should be Strongly Considered when the OEM’s Goal is To Deliver Optimum Balance between Landed Cost and Time to Market

Sep 29, 2016 | Brian Graham

The old tactic of outsourcing to a low cost geography simply to deliver lowest cost direct and indirect labor was never a panacea supply chain solution. In fact, when evaluating solutions for lower volume and higher mix products typically found in the medical, industrial and public safety segments of the OEM market, IL & DL costs are only one subset of the total cost to land the product and service the ultimate customer.

In this paper, there will be examination of what actual cost components should be included in a landed cost analysis, the soft costs that an OEM should consider to deliver outstanding performance in quality, logistics and delivery management of the supply chain solution. A detailed comparison using a 'case study' will be presented to demonstrate a total landed cost option versus one that is focused on IL/DL cost....

Precision Auger Dispense Pump