FaradFlex� - Materials for Embedded Capacitance

FaradFlex� - Materials for Embedded Capacitance Description:

Oak-Mitsui has developed a novel thin substrate, FaradFlex�, which is the next generation of Buried Capacitance material.

Buried Capacitance utilizes the technology of putting a capacitor plane inside the PCB to reduce the overall impedance of the power distribution system as well as free up surface real estate and improve system reliability by eliminating some discrete capacitors.

For more information, visit: http://www.faradflex.com/pages/advancedTechnology/faradFlex.asp