SMT Equipment

CXP - Cost Effective Thermal Warpage Measurement Tool

CXP - Cost Effective Thermal Warpage Measurement Tool

CXP - Cost Effective Thermal Warpage Measurement Tool

Name:

CXP - Cost Effective Thermal Warpage Measurement Tool

Category:

Test Equipment

Offered by:

Akrometrix

Company Information:

Akrometrix

Leading provider of full-field metrology solutions for substrates and packages in the OEM/CEM/SATS/PCB segments of the microelectronics industry.

Atlanta, Georgia, USA

OEM, Service Provider

  • Phone 404-486-0880
  • Fax 404-486-0890

Akrometrix website

Company Postings:

(6) products in the catalog

(5) technical library articles

(25) news releases

CXP - Cost Effective Thermal Warpage Measurement Tool Description:

The CXP (Convection Expandable Platform) is a low cost, stand alone equipment primarily targeted at the EMS and PCB Fab Market. The CXP uses the Digital Fringe Projection technique to measure a field of view of 64x48mm with a measurement resolution of 5 microns. The CXP use the same Studio software used to run the Akrometrix TherMoiré platforms.

The CXP uses a convection oven for heating and cooling and includes a 2MP camera and projector for DFP measurements. The CXP oven can hold samples up to 300x300mm in size and the 64x48mm field of view is movable around the full oven 300x300mm field of view through a sliding gantry.

The CXP provides a cost effective solution for customers looking to adhere to the IPC 9641 industry standard concerning measuring local board warpage.

Digital Fringe Projection

The Digital Fringe Projection (DFP) technique compliments the shadow moiré technique by adding step height measurement capabilities at high data point density. This technique is particularly useful for measurement of connectors, sockets, assembled modules, and PCB local areas. No grating is needed for the DFP technique, which helps with issues like outgassing and temperature uniformity sometimes seen with the shadow moiré technique. DFP also has the advantage of not being limited by data density, unlike the shadow moiré technique.

DFP has the disadvantage of warpage resolution being dependant on field of view. For this technique a field of view of 64x48mm, generating a measurement resolution of 5 microns, was chosen for the DFP Module and CXP.

CXP - Cost Effective Thermal Warpage Measurement Tool was added in Mar 2015

CXP - Cost Effective Thermal Warpage Measurement Tool has been viewed 461 times

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