TherMoiré® PS600S Thermal Warpage Measurement Tool

TherMoiré® PS600S Thermal Warpage Measurement Tool Description:

The TherMoiré® PS600S is a metrology solution that utilizes the shadow moiré measurement technique combined with automated phase-stepping to characterize out-of-plane displacement for samples up to 600 mm x 600 mm. With time-temperature profiling capability, the TherMoiré® PS600S captures a complete history of a sample’s behavior during a user-defined thermal excursion.

The combination of the shadow moiré technique and dynamic temperature profiling is the foundation of the patented TherMoiré® platform. Dynamic profiling is the most effective approach to analyze mechanical behavior induced by real-world processes and operating environments. Using the TherMoiré® PS600S, engineers will gain a better understanding of the interactions of materials, packages, substrates and complete assemblies, allowing for a thorough analysis of the system, improving its reliability and operating performance.

The PS600S is designed to meet the requirements of OEMs, PCB fabs and contract manufacturers who need large board/assembly characterization. With its 600 mm x 600 mm field of view, the PS600S is the largest temperature-dependent metrology tool available for the microelectronics industry.

The PS600S can be used in the laboratory:

• Failure/defect analysis
• Quality assurance/quality control
• High Volume Testing complimented by Part Tracking technology
• Pass/Fail decisions versus industry standards, streamlined by Real Time Analysis software
• Shape matching between attaching interfaces via Interface Analysis Software
• Material and Design Choices
• FEA Model Validation