SMT Equipment

AKM600P - Wafer/Panel Thermal Warpage Measurement Tool

AKM600P - Wafer/Panel Thermal Warpage Measurement Tool

AKM600P - Wafer/Panel Thermal Warpage Measurement Tool

Name:

AKM600P - Wafer/Panel Thermal Warpage Measurement Tool

Category:

Test Equipment

Offered by:

Akrometrix

Company Information:

Akrometrix

Leading provider of full-field metrology solutions for substrates and packages in the OEM/CEM/SATS/PCB segments of the microelectronics industry.

Atlanta, Georgia, USA

OEM, Service Provider

  • Phone 404-486-0880
  • Fax 404-486-0890

Akrometrix website

Company Postings:

(6) products in the catalog

(5) technical library articles

(25) news releases

AKM600P - Wafer/Panel Thermal Warpage Measurement Tool Description:

The AKM600P is a metrology solution that utilizes the shadow moiré measurement technique combined with automated phase-stepping to characterize out-of-plane displacement for wafers or panels up to 600 mm x 600 mm. With time-temperature profiling capability, the AKM600P captures a complete history of a sample’s behavior during a user-defined thermal excursion.

Perfect for the Fan Out Wafer Level Packaging Market (FOWLP), the AKM600P is a bridge tool – allowing companies the flexibility to measure wafers of any size and panels (up to 600mm x 600mm) on the same platform without any changing out of fixtures, etc.

The combination of the shadow moiré technique and dynamic temperature profiling is the foundation of the patented TherMoiré® platform. The AKM600P has software specifically tuned to working with wafer and panel warpage applications.  The system is capable of measuring global warpage of a large wafer or panel, and at the same time the tool can capture hundreds of die local areas on the surface.  This simultaneous measurement of global and hundreds of local areas occurs in only 2 seconds.

The AKM600P can be used in the laboratory:

  • Failure/defect analysis
  • Quality assurance/quality control
  • High Volume Testing complimented by Part Tracking technology
  • Pass/Fail decisions versus industry standards, streamlined by Real Time Analysis software
  • Shape matching between attaching interfaces via Interface Analysis Software
  • Material and Design Choices
  • FEA Model Validation

AKM600P - Wafer/Panel Thermal Warpage Measurement Tool was added in Aug 2016

AKM600P - Wafer/Panel Thermal Warpage Measurement Tool has been viewed 673 times

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