SMT Equipment


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All aspects of electronic interconnect solutions are available, including package and substrate design and lay-out, thermal analysis, high-speed simulation, process development, test engineering, and materials procurement. Technology assessment generally involves short turnaround times and consist of one or more of the following activities:

San Diego, California, USA


  • Phone 1-858-430-1120
  • Fax 1-858-309-6619

NxgenElectronics website

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(1) product in the catalog Description:

Aluminum Wirebonding Gold Wirebonding Gold Ribbonbonding Wafer Bumping Flip Chip Packaging BGA LGA SMT Direct Chip Attach System In Package Hybrid MCM Stacked Die 3D Packaging 3D Memory Rad Hard RF Packaging was added in May 2008 has been viewed 2 times

PCB equipment

Used smt