850G Die Placement AOI
850G Die Placement AOI Description:
Microelectronics and Semiconductor Inspection.
MVP's 850G provides the highest accuracy flip-chip, die assembly inspection. Ensuring the correct placement of the die on the substrate, while providing edge, FM and surface inspection.
The 850G modular AOI Inspection platform provides a range of advanced optic and handling solutions including 3D, high-resolution imaging and quad color lighting. Camera resolutions are scalable to resolutions below 1 Micron. In addition a range of custom material handling configurations are available including; magazine handling, strip handling, tray handling and wafer handling. For in-line operations, single and dual lane options are also available to process microelectronic or semiconductor assemblies.
Process yields can be substantially increased using metrology to control the Die alignment processes, flux and paste, prior to reflow, ensuring good parts after this process. With resolutions down to 1um the 850G can provide the highest accuracy for defect detection. In this environment, the systems, as standard, are configured for in-line, high speed die placement metrology.
For wirebond inspection whether you are using 20um gold wire or 250um Aluminum wire, ball bonds or wedge bonds, MVP’s 850G provided the resolution and capabilities for complete wire bond inspection.
MVP’s proprietary algorithms use multi‐registration techniques to accommodate for bond and die placement, to allow complete wire and bond inspection across different substrates and dies.
To allow for the inspection of multi-level substrates MVP provide our proprietary Z-Height module, making the Ultra 850G the most flexible wirebond inspection solution.
Leading Capabilities Include:
- 1um Resolution
- Bump/Ball Inspection
- Gold, Copper and Aluminum Wire
- Bond Shape, Position and Dimensions
- Epoxy Flow and Spread
- Die Placement
- Die Surface, Edge Cracking, Damage
- Foreign Material
Quad Color Technology
MVP’s Quad-Color Technology allows faster inspection cycle times while increasing inspection capabilities. Additionally, it helps broaden the defect coverage and lower false rejects.
Tri-Color Technology complements MVP’s wide range of award winning AOI products and further allows the introduction of flexible solutions with the capability to increase performance and speed metrics at the same time.
Software Tools and Quality Control
Innovative tools such as ePro, Validate, Auto-Optimize and iRepair, ease the programming process while still providing the highest quality programs.
Global Service and Support
MVP recognizes the global nature of the electronics industry and has set itself up in a position to be able to follow its customers around the globe. As a consequence, a cornerstone of our service strategy is to provide local support so that close client partnerships can be developed and maintained over time.
MVP's application engineering support is provided by our local distributor in each country and by our three head offices, the world headquarters in California, the European head office in the UK, and MVP's Asia-Pacific office in Shanghai, China. We offer local engineering support within 24 hours, and application engineers from headquarters are available for assistance within 36 hours.
850G Die Placement AOI was added in Jan 2014
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