SMT Equipment

Ultra SPI - 3D Solder Paste Inspection System

Ultra SPI - 3D Solder Paste Inspection System

Ultra SPI - 3D Solder Paste Inspection System

Name:

Ultra SPI - 3D Solder Paste Inspection System

Category:

Inspection

Offered by:

Machine Vision Products, Inc

Company Information:

Machine Vision Products, Inc

MVP is a market innovator and leader in imaging technologies for Surface Mount, Microelectronics and Packaging Technologies providing solutions for both commercial and military applications.

Vista, California, USA

Inspection

  • Phone 7604381138

Machine Vision Products, Inc website

Company Postings:

(10) products in the catalog

(80) news releases

Ultra SPI - 3D Solder Paste Inspection System Description:

MVP’s enhanced Ultra SPI Solder Paste Inspection systems deploy our patented 3D technologies along with MVPs trusted AOI capabilities. Utilizing MVP’s patented technology, 3D Solder Paste Inspection (SPI) can be performed on paste for apertures as small as 01005 and Micro-BGA. In addition MVP’s latest SPI solutions provide support for Dual Lane, Multiple Panel Inspection and microelectronics as well as full SPC reporting and data outputs.

  • Full Solder Paste Inspection (SPI)
  • Standard Gerber Import Utilities
  • Fastest Programming
  • Accurate Defect Identification
  • Ultimate Flexibility
  • Accurate Height Measurement for SMT and Microelectronics Processes

Ultra SPI - 3D Solder Paste Inspection System was added in Apr 2015

Ultra SPI - 3D Solder Paste Inspection System has been viewed 260 times

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