Christopher Associates, founded in 1977, is a pioneering supplier to the printed circuit and electronics assembly industries. We believe the foundation of our success is our dedication to technical expertise, combined with an unmatched commitment to personal service.
Christopher Associates Inc. Postings
Select from Three Standard Types to Suit Work Size and Work Environment: UNIX-412R, UNIX-413R, UNIX-414R Built-in soldering robot program Available in 3 sizes 255 program on board memory 30,000 po...
The 3D Profiler is an automatic machine to measure the dent of the copper filled vias. The system offers the opportunity for 100% inspection to ensure the yield of the copper filling with inspection speeds of 5 minutes per panel and +/- 2 micron a...
Mar 06, 2014 | Jasbir Bath, Roberto Garcia - Christopher Associates Inc. Noriyoshi Uchida, Hajime Takahashi, Gordon Clark, Manabu Itoh - Koki Solder
Over the last few years, there has been an increase in the rate of Head-in-Pillow component soldering defects which interrupts the merger of the BGA/CSP component solder spheres with the molten solder paste during reflow. The issue has occurred across a broad segment of industries including consumer, telecom and military. There are many reasons for this issue such as warpage issues of the component or board, ball co-planarity issues for BGA/CSP components and non-wetting of the component based on contamination or excessive oxidation of the component coating. The issue has been found to occur not only on lead-free soldered assemblies where the increased soldering temperatures may give rise to increase component/board warpage but also on tin-lead soldered assemblies....
Jan 24, 2013 | Jasbir Bath, Manabu Itoh, Gordon Clark, Hajime Takahashi, Kyosuke Yokota, Kentaro Asai, Atsushi Irisawa, Kimiaki Mori, David Rund, Roberto Garcia
The electronics industry has mainly adopted the higher melting point Sn3Ag0.5Cu solder alloys for lead-free reflow soldering applications. For applications where temperature sensitive components and boards are used this has created a need to develop low melting point lead-free alloy solder pastes. Tin-bismuth and tin-bismuth-silver containing alloys were used to address the temperature issue with development done on Sn58Bi, Sn57.6Bi0.4Ag, Sn57Bi1Ag lead-free solder alloy pastes. Investigations included paste printing studies, reflow and wetting analysis on different substrates and board surface finishes and head-in-pillow paste performance in addition to paste-in-hole reflow tests. Voiding was also investigated on tin-bismuth and tin-bismuth-silver versus Sn3Ag0.5Cu soldered QFN/MLF/BTC components. Mechanical bond strength testing was also done comparing Sn58Bi, Sn37Pb and Sn3Ag0.5Cu soldered components. The results of the work are reported....
Apr 10, 2012 | Christopher Associates Inc. today announced that it will highlight the Tagarno MAGNUS HD TREND at the upcoming SMTA Toronto Expo & Tech Forum,
Apr 02, 2012 | Christopher Associates Inc. today announced that it will highlight the Tagarno MAGNUS HD TREND in Booth #346 at the upcoming Del Mar Electronics & Design Show (DMEDS), scheduled to take place May 2-3, 2012 at the Del Mar Fairgrounds in San Diego, CA.
Mar 16, 2012 | Christopher Associates Inc. today announced that it will highlight the Tagarno MAGNUS HD TREND at the upcoming IMAPS NE 39th Symposium & Expo,
Mar 13, 2012 | SANTA ANA, CA — March 2012 ― Industry-leading solutions provider Christopher Associates Inc. made quite the splash with both exhibitors and attendees at the IPC APEX EXPO 2012 in San Diego, CA (2/28-3/1).
Mar 05, 2012 | Christopher Associates has been awarded a 2012 NPI Award in the category of Rework and Repair Tools for its MAGNUS HD TREND from Tagarno.
Feb 22, 2012 | Christopher Associates Inc. introduces the S-1 solder paste inspection system from MEK. The S-1 represents the leading edge in solder paste inspection technology.
Feb 03, 2012 | Christopher Associates announces that its distributor, TLS Technologies, will display the industry favorite Tagarno Magnus HD Trend at two upcoming SMTA shows.
Jan 30, 2012 | Christopher Associates announces that Jasbir Bath, Consulting Engineer with Christopher Associates/Koki Solder, will moderate Session S21, titled “Solder Joint Testing and Performance,” at the upcoming IPC APEX conference and exhibition.
Jan 26, 2012 | Christopher Associates announces that Jasbir Bath, Consulting Engineer with Christopher Associates/Koki Solder, will present at the IPC APEX EXPO 2012. The presentation, “Low Temperature Tin-Bismuth and Tin-Bismuth-Silver Lead-free Solder Pastes for Electronics Manufacturing,” will take place during Session S16, titled “Lead-free Alloys,”.
Jan 21, 2012 | Christopher Associates announced plans to unveil a new SPI unit in Booth #2801 at the upcoming IPC APEX Expo.