Symbion P36 Plus - SPI System
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Symbion P36 Plus - SPI System |
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Symbion P36 Plus - SPI System Description:
Symbion P36 is an inline high-speed API solution that delivers 100% coverage for improving your product quality and boosting your productivity.
- Post-Paste AOI
- Instant Programming
- Easy Gerber Import
- 2D/3D Laser Path
Superior POP™ Detection Technology
Unlike other paste inspection solutions that have to compromise on either speed or resolution, Symbion P36 Plus’ patented POP technology employs a revolutionary approach to inspection that achieves the very highest resolution at or above line speed. POP utilizes an optimized scanning technique with two scan lines operating simultaneously via independent optical channels for 3-D and 2-D image acquisition. This enables 100% full board coverage and precise measurements of solder paste deposit volume, area, shape, and location. Orbotech’s unique 3-D laser triangulation method provides a clear, angled view for solder paste height mapping at the fine resolution of 5 μm. A true 2-D laser illumination channel ensures excellent top views of the solder paste at 20 x 20 μm resolution. The result is an exceptionally quick and complete picture of each solder paste deposit with virtually no false calls. Powerful image processing algorithms and techniques ensure highly accurate measurement, detection and classification.
For extra detection coverage on critical or challenging components or deposits, the system can be programmed to conduct intelligent BOM-linked solder paste analysis based on component and package-specific attributes with userdefined thresholds and inspection tolerances. To compensate for board warpage that can often be much greater than the solder paste deposit height, specially designed algorithms, optical techniques and hardware automatically adjust for an entire range of warpages (+3, - 6mm) during board scanning.
Symbion P36 Plus is a real measurement system with Gage R&R of less than 10% for typical process tolerances.
Ultra Fast Inspection Speed
The system is enhanced with streamlined architecture and powerful detection techniques for high throughput. It requires very little user interaction and has no need for constant attention, giving you maximum productivity. POP’s optimized image acquisition and “on-the-fly” image processing quickly inspect the entire board. Wizard & Go makes programming and setup fast and efficient. With a scan speed of up to 60 cm²/sec., Symbion P36 Plus keeps pace with your line speed today and is ready for when your throughput requirements increase.
Easy Wizard & Go™ Operation
Symbion P36 Plus features Orbotech’s innovative Wizard & Go operation for the ultimate in simplicity. With the ‘point-and-click’ workflow wizard, using the system is easy and training time is quick. The wizard guides you through each stage of program creation, giving you consistent performance. You can be ready for board inspection in less than ½ hour. Just Wizard & Go! Adjusting your program, verifying new settings and tracking your progress is effortless using Symbion’s easy-to-follow graphic interface and tools. With full off-line programming capabilities, there is no need to use valuable machine time.
Closed Loop Feedback with ADVISOR Central™
Symbion P36 Plus features many integrated capabilities for closed-loop feedback that can be incorporated into your SMT line process control strategy. The system delivers highly accurate solder paste measurement data to the ADVISOR Central™ database. This is combined with information from other SMT line systems, via a straightforward open-system protocol. Using the comprehensive monitoring and analysis tools available in ADVISOR Central™ and its alarm engine for process excursion notification, you can quickly identify trends that lead to defective boards and eliminate sources of errors.
Specifications:
FUNCTIONAL SPECIFICATIONS |
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Paste Inspection Method |
Independent acquisition of appearance and height images resulting in accurate calculation of paste deposit position and volume |
Image & Illumination System |
CMOS-based image sensors with two independent laser diode illumination channels: (1) multi-angle illumination channel for top image acquisition, (1) triangulation channel for 3D image acquisition |
Inspection Head |
X-Y-Z moving inspection head |
Handling System |
Board is in a fixed (stationary) position during inspection |
Area Resolution |
X, Y 20 μm (0.8 mil) |
Height Resolution |
Z 5 μm (0.2 mil) |
Inspection Mode |
Optimized serpentine scanning for full board coverage |
Paste Types Supported |
All paste types 1-6, including lead-free types |
Board Finishes Supported |
All pad and board finishes including: Pad finishes: HAL, nickel gold, organic, etc. |
SPC & Process Control |
On-system SPC tools with deposit level control charts, Cp and Cpk analysis. ADVISOR Central™ database and software tools for defect prevention |
Copy Exact |
Accurate system with excellent copy exact capabilities |
BOARD SPECIFICATIONS |
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Maximum Board Size |
508 × 540 mm (20 × 21 in.) |
Maximum Board Warp |
+3, -6 mm, automatic (+ 0.12 -0.23 in,) |
Board Edge Clearance |
2.5mm |
Board Underside Clearance |
Up to 50 mm ( 2in.) |
Board Topside Clearance |
Up to 12 mm ( 0.47 in.) |
Adjustable Board Width |
Automatic |
Conveyor Height |
SMEMA standard 870-930 mm |
PERFORMANCE SPECIFICATIONS |
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Inspection Speed |
Up to 60 sq. cm/sec (9.3 sq. in/sec) |
Paste Height Range |
50-300μm (0.2 – 12 mil) |
Area Measurement |
No maximum limit on feature size |
Load, Unload and Fiducial Finding |
4-6 seconds (depending on board size) |
Height Accuracy / Repeatability |
5 μm (0.2 mil) on certified targets / Sigma < 1μm (0.04 mil) |
X-Y Area |
10 μm (0.4 mil) |
Gage R&R |
Below 10% for typical process tolerances |
SOFTWARE SPECIFICATIONS |
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Operating System |
Windows XP |
Software Design |
Object-oriented |
Single Board / Multi-Board |
Possible to define inspection based on step & repeat of single board. Single board behaves as an object for analysis and reporting |
Component Correlation |
Inspection criteria and defect reporting based on component level. |
Verification |
Support of several operating modes of verification including: on-system,dedicated verification station (VeriFast21), stopping the system if critical amount of defects are found (user-defined), connection to Orbotech post-reflow AOI to verify paste defects, remote image verification (RIV)using ADVISOR Central™. |
INTERFACE SPECIFICATIONS |
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Data Input Types |
Extended Gerber (RS-274X), CAD, BOM and GenCAM with easy parsing templates |
Board Interface |
SMEMA and Extended SMEMA for left-to-right, right-to-left, rear and front fixed rail operation, SV70 |
Host Communication |
100Mbit twisted pair Ethernet supporting TCP/IP or Microsoft network |
Data Transfer Tools |
Via ADVISOR Central™: MSSQL queries and database-to-database, XML file structure of recipe file. |
Barcode |
1D, 2D (matrix) barcode support |
Remote Diagnostics |
System designed to support remote diagnostics for hardware and software |
OTHER SPECIFICATIONS |
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Dimensions |
W 1000 mm x D 1550 mm x H 1450 mm (W 39.4 x D 61 x H 57 in) |
Weight |
700 Kg (1540 lbs) |
Design |
Conforms to CE and UL safety regulations |
Options |
ADVISOR Central™ database and software for defect prevention, Barcode scanner, Offline programming station |
Symbion P36 Plus - SPI System was added in Jun 2009
Symbion P36 Plus - SPI System has been viewed 879 times
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