PRO 1600 - Forced Convection SMT Reflow Oven

PRO 1600 - Forced Convection SMT Reflow Oven Description:

PRO 1600 is a full forced air / nitrogen convection reflow oven that covers only 31" x 31" of floor space. It has been designed for reflow soldering of even the most challenging applications including, high thermal mass and lead free assemblies. PRO 1600 is very flexible in terms of profile development and optimization. Sealed heating chamber enables air ramp up rates of up to 4° Celsius/second and programming of up to 10 profile zones. Its unique on-the-fly settings adjustment capability allows creating and optimizing profiles all in a single pass. Where other batch and conveyor ovens fail to meet the desired profile curve, PRO 1600 excels.

Precise software control delivers unsurpassed temperature uniformity. Maintaining a low delta T across all of the components on the assembly ensures that they are not overheated or thermally stressed. Even for prototypes, this often means avoiding to spend hours of testing and debugging failed boards. With the optional External Thermocouple Control (ETC), profiles may be processed based on temperature readings of the assembly, not the air temperature around it. Increased productivity, superior performance and ease of operation make the PRO 1600 a versatile system ideal for small to medium run production, prototyping, testing or curing.

Key Features:

• Full Convection and Lead Free Compatible Reflow Oven
• Up to 10 individually programmable zones
• Small Footprint
• Computer control with unlimited profile storage capacity
• Comprehensive software package with monitoring and profiling capability
• No Warm-Up time required before operating
• Integrated Exhaust / Fume Cleaning Unit
• Nitrogen ready with low rates of consumption
• External Thermocouple Control
• Automatic Profile Repeat function (up to 10 times)
• Library of predefined profiles
• Password protected login for engineers and operators
• Plug and Operate Configuration
• Minimal maintenance
• Designed and Manufactured in US

Profile Programming

The following parameters may be programmed for each profile:

• Up to 5 Ramp Up stages ( ° Celsius / second)
• Up to 5 Temperature stages
• Up to 5 Time at Temperature stages
• Up to 4 In-Process Cooling stages
• Final Cooling stage
• Cooling Modes - 4 types
• Initial Lag time
• Nitrogen purge
• Automatic Profile Repeat (up to 10 times)

Software

Profiles are developed, stored, and recalled within PRO 1600’s software package. It controls the reflow cycle, automation of process sequences, and automatic execution of safety checks before and during every profile run.

• Real-Time process graphing
• Profile processing based on part / PCB temperature control* 
• Profile development with up to 7 thermocouples*
• Library with predefined profiles
• On-The-Fly settings adjustment
• Real- time data recording for documentation and analysis
• Password Protected Access
• User friendly environment
• Designed for Windows® XP / Vista / 7 Pro OS

Specifications: