Research – Tin Whiskers, Copper Dissolution, Legacy

Research – Tin Whiskers, Copper Dissolution, Legacy Description:

The areas in which we are conducting research comprise a comprehensive group of inter-related issues and concerns involving all military, industrial and commercial electronics users facing conversion to lead free solder alloys.

REI’s DoD currently focuses on research topics including Tin Whiskers, Copper Dissolution, and BGA Legacy Repairs. The research done in conjunction with our two partners – Radiance Technologies or Huntsville, Alabama, and South Dakota School of Mines and Technology (SDM&T) – are advancing the search for solutions now that lead has been removed from the soldering process world-wide. The removal of lead is causing the reemergence of “tin whiskers” on a global scale in electronics manufacturing.