Qual-Pro is an Electronics Manufacturing Service EMS provider certified to AS9100 aerospace devices, ISO 9001 and ISO 13485 medical devices quality standards. Our range of expertise encompasses complex Printed Circuit Board PCB assemblies and full-box builds. To more than 200 customers, we have offered the complete range of electronics manufacturing services including turnkey system assembly, flex assemblies, BGA and micro-BGA placements, functional and in-circuit testing ICT, electro-mechanical assembly and design for manufacturability DFM services. Qual-Pro specializes in high-mix, low-to-medium volume assemblies, quick-turn prototypes and new product introduction NPI services.
We provide complete manufacturing engineering and integrated supply chain services to all our customers. Qual-Pro has been providing electronics assembly services to specific market sectors such as the defense, aerospace, commercial, medical, industrial and automotive continuously since 1971. We are a veteran and woman owned small business.
Example customers: 3M, BAE Systems, Boeing, DRS Sensors, Goodrich, L3 Communications, Northrop Grumman Aerospace Systems, Northrop Grumman Mission Systems, Northrop Grumman Information Systems, Northrop Grumman Space Technology, Parker Hannifin, Raytheon, Space Exploration Technologies (SpaceX), Trident Space and Defense, Teledyne.
Qual-Pro Corporation Postings
Mar 07, 2018 | Gabriel Briceno, Ph. D., Miguel Sepulveda
This study investigates the scooping effect during solder paste printing as a function of aperture width, aperture length and squeegee pressure. The percent of the theoretical volume deposited depends on the PWB topography. A typical bimodal percent volume distribution is attributed to poor release apertures and large apertures, where scooping takes place, yielding percent volumes <100%, while SMD apertures and apertures near PWB features that raise the stencil yield percent volumes >100%. This printing experiment is done with a concomitant validation of the printing process using standard 3D Solder Paste Inspection (SPI) equipment....
Mar 09, 2012 | LOS ANGELES, CA – March 9, 2012 – Qual-Pro Corporation, an industry leading electronics manufacturing service provider for high-reliability, mission-critical electronics, today announced that the company has installed conformal coating equipment. A dedicated engineering team with decades of electronics manufacturing experience supports the conformal coating function.
Jan 23, 2012 | Qual-Pro today announced it has appointed Alex Richardson as Vice President, Sales, effective immediately. Reporting to Qual-Pro’s CEO, Brian Shane, Richardson will be responsible for growing the company’s sales through new customer acquisition.
Mar 14, 2011 | Qual-Pro Corporation today announced that the company was awarded UL 508A certification.
Jan 10, 2011 | Qual-Pro today announced it has appointed Bob Miller as Vice President, Sales, effective immediately. Reporting to Qual-Pro’s CEO, Brian Shane, Miller will be responsible for growing and managing the company’s sales organization.