TR7700QM SII - Metrology-grade Inspection
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TR7700QM SII - Metrology-grade Inspection |
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TR7700QM SII - Metrology-grade Inspection Description:
The TR7700QM SII is built on a high accuracy platform with 5.5 µm high resolution 12 MP imaging technology for the Semiconductor & Packaging industry. The Stop-and-Go 3D AOI can inspect wire bonds, die bonds, SMD, bumps, and solder joints. The Smart 3D AOI solution's accuracy is enhanced with metrology capabilities and flexible inspection algorithms.
Features:
- Semiconductor and Packaging technology Inspection.
- 5.5 μm Resolution for Ultra-High Precision Metrology-grade Inspection
- Ready to Inspect in Minutes with TRI's Smart Programming
- Multiple 3D Technologies for Full coverage Inspection
TR7700QM SII - Metrology-grade Inspection was added in Jul 2022
TR7700QM SII - Metrology-grade Inspection has been viewed 128 times
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