Direct Die Attachment
Direct Die Attachment Description:Directly bonding to silicon and packaging materials typically requires the use of a flux or thin film metallization of the joining surfaces. SBT offers options for bonding to silicon, metal, ceramic and ceramic composite materials without metallization or flux which, in many cases, can withstand lead free solder reflow cycles for board mounting.
Direct Die Attachment was added in Nov 2010
Direct Die Attachment has been viewed 136 times