SMT Equipment

Direct Die Attachment

Direct Die Attachment

Direct Die Attachment


Direct Die Attachment


Assembly Services

Offered by:

S-Bond Technologies

Company Information:

S-Bond Technologies

Brazing and soldering, metal bonding, dissimilar materials, active solder technology

Lansdale, Pennsylvania, USA

Contract Manufacturer

  • Phone 215-631-7114
  • Fax 215-631-7115

S-Bond Technologies website

Company Postings:

(6) products in the catalog

Direct Die Attachment Description:

Directly bonding to silicon and packaging materials typically requires the use of a flux or thin film metallization of the joining surfaces. SBT offers options for bonding to silicon, metal, ceramic and ceramic composite materials without metallization or flux which, in many cases, can withstand lead free solder reflow cycles for board mounting.

Direct Die Attachment was added in Nov 2010

Direct Die Attachment has been viewed 136 times

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