Engineered Conductive Materials (ECM) is a brand of Engineered Materials Systems, Inc. (EMS). ECM’s technology focus is electronic circuit fabrication which compliments EMS’s circuit assembly product line.
We encourage plant visits by our customers. Our technical department is staffed with application specialists who are available to address and solve our customers' design needs. We have an extensively equipped development laboratory with state of the art electrical, thermal and structural analysis equipment. We invite you to share your application requirements with us. Simply fill out our sample request form and submit it.
Engineered Conductive Materials, LLC Postings
Nov 15, 2016 | Engineered Materials Systems today announced its new EMS 561-854 Fast Cure Conductive Adhesive for die-attach applications with small- to medium-size die and tantalum capacitors. EMS 561-854 is designed to cure in one minute at 170ºC.
Oct 06, 2016 | Engineered Material Systems will exhibit at Semicon Europa, scheduled to take place Oct. 25-27, 2016 in Grenoble, France. Company representatives will showcase both liquid and dry-film negative photoresist for use in microfluidics, wafer level packaging and CMOS applications (TSV sealing/passivation). These material formulations have been optimized for spin coating (liquid) or hot roll lamination (dry film) and processing on MEMS and IC wafers.
May 09, 2016 | Engineered Material Systems will exhibit its new 561-400 series Low-Cost Snap Cure Conductive Adhesives at the Intersolar/EU PVSEC show, scheduled to take place June 23-25, 2016 in Munich. The 561-400 series is designed for stringing and shingling crystalline silicon and heterojunction solar modules.
Aug 23, 2015 | Engineered Material Systems, will showcase its 561-403 Conductive Adhesive at the EU PVSEC show, scheduled to take place September 15-17, 2015 in Hamburg, Germany. EMS 561-403 is a snap cure, low cost conductive adhesive designed for Heterojunction (HIT) and Multi Bus Bar silicon solar modules.
Feb 26, 2013 | Engineered Material Systems debuts its DB-1568-1 Low Temperature Cure Die Attach Adhesive for attaching semiconductor die in temperature-sensitive devices.
Jan 21, 2013 | Engineered Material Systems debuts its 561-50 Low Temperature Cure Die Attach Adhesive for attaching semiconductor die in temperature-sensitive devices
Dec 04, 2012 | Engineered Conductive Materialsintroduces the fast curing CA-141 Conductive Adhesive for stringing and bussing next-generation CIGS solar modules.
Nov 27, 2012 | Engineered Conductive Materials, LLC,, will present “Conductive Adhesives for Back Contact Solar Modules” during the upcoming China Solar Grade Silicon and PV Power Conference (CSPV), scheduled to take place December 6-8, 2012 at the Shanghai Nan Jiao Hotel in Shanghai, China.
Nov 27, 2012 | Rocket EMS Inc has achieved ISO 13485:2003 certification. This internationally recognized standard acknowledges the suitability of the company’s quality management system for the design and manufacture of medical devices.
Nov 02, 2012 | Engineered Conductive Materials, announces that Rich Wells will present “Conductive Adhesives for Back Contact Solar Modules” during the upcoming MWT Workshop, scheduled to take place November 20-21, 2012 at the Nemo Center in Amsterdam, The Netherlands.