Your expert in Robotic Hot Solder Dip (HSD), Column Attach, Ball Grid Array (BGA) to Column Grid Array (CGA) conversions, Ball Attach, BGA Reballing, and Trim & Form. Also Failure Analysis, Bond Pull, Mark Permanency, Ball Shear, XRF, Solderability, and Fine & Gross Leak Testing.
For over 21 Years, SIX SIGMA has been advancing lead finish and soldering technology for the military, aerospace, and commercial micro-electronics component industry. SIX SIGMA is the technical leader and subcontractor of choice for the alteration and testing of micro-electronic components to increase reliability, mitigate tin whiskers, or achieve RoHS compliance. Our team of experienced semiconductor assembly engineers is committed to obtaining component lead finish excellence through the development of innovative manufacturing processes and solutions.