3D SPI-7500 solder paste thickness gauge

3D SPI-7500 solder paste thickness gauge Description:

Detailed introduction of 3D spi-7500 solder paste thickness gauge

 Product function

Fast programming, friendly programming interface

1. Multiple measurement methods

2. True one button measurement

3. Eight square movement button, one key focus

4. The scanning distance is adjustable

5. Solder paste 3D simulation function

6. Powerful SPC function

7. Mark deviation automatic correction

8. One key back to the screen center function

 Product features

Automatic target recognition

The full-automatic 3D solder paste thickness tester can obtain 3D data of each point by automatically focusing the moving / z-axis image of the automatic XY platform and scanning the solder paste by laser. It can also be used to measure the average thickness of the solder paste of the whole pad, making the solder paste printing process well controlled.

[features]

1. Programmable measurement of several areas, automatic focusing at different test points to overcome the error caused by plate deformation;

2. The PCB mark can automatically find the inspection position and correct the offset;

3. Measurement mode: full automatic, automatic movement, manual measurement, manual movement and manual measurement;

4. Solder paste 3D simulation diagram, reproduce the real appearance of solder paste;

5. It adopts 3-axis automatic moving and focusing, and automatically compensates and corrects the warpage of the substrate to obtain the accurate solder paste height;

6. High speed and high resolution camera, high precision, powerful SPC data statistical analysis;

7. Sigma automatic discrimination function enables your operator to judge the quality of solder paste printing process in real time;

8. Automatically generate CP, Cpk, X-bar, r-chart, sigma column chart, trend chart, control chart, etc;

9. 2D auxiliary measurement, distance between two points, area size, etc;

10. The data list of measurement results is saved automatically and SPC report is generated.

It can switch three different 3D dynamic display modes in real time, zoom in and out and rotate

 Product parameters

1. Application: solder paste. Red glue BGA.FPC.CSP

2. Measurement items: thickness, area, volume, 3D shape, plane distance

3. Measurement principle: laser 3-angle function method

4. Software language: Chinese / English

5. Lighting source: white bright LED

6. Measuring light source: red laser module

7. X / y moving range: Standard 350mm * 340mm (larger moving size can be customized)

8. Measurement mode: Automatic full screen measurement. Frame selection automatic measurement. Frame selection manual measurement

9. Field of vision: 5mm * 7mm

10. Camera pixel: 3 million / field of view

11. Maximum resolution: 0.1um

12. Scanning interval: 4 um / 8 um / 10 um / 12 um

13. Repeat measurement accuracy: height less than 1um, area < 1%, volume < 1%

14. Magnification: 50x

15. Maximum measurable height: 5 mm

16. Maximum measuring speed: 250profiles / S

17. 3D mode: rendering, surface, line and point three different 3D simulation images, which can be scaled and rotated

18. SPC Software: production line data, printing data, solder paste data, steel mesh data, independent analysis of measurement results, X-bar & R diagram analysis, histogram analysis & CA / CP / CPK output, sigma automatic judgment

19. Operating system: Windows 7

20. Computer system: dual core P4, 2G memory, 20 inch LCD

21. Power supply: 220 V 50 / 60 Hz

22. Maximum power consumption: 500W

23. Weight: about 85kg

24. Overall dimension: L * w * H (700 mm * 800 mm * 400 mm)