Automatic solder paste printing machine
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Automatic solder paste printing machine |
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Automatic solder paste printing machine Description:
Solder paste printing range
(1) SMT technology of resistance, capacitance, inductance, diode, triode and other chip components production and processing: 01005, 0201, 04020603, 0805, 1206 and other specifications and sizes;
(2) , IC: support SOP, TSOP, tssop, QFN and other packages, with a minimum pitch of 0.3mm;
BGA and CSP packaging are supported, and the minimum ball diameter (ball) is 0.2mm;
(3) Printing size: 50mm x 50mm ~ 370 × 470mm;
(4) PCB specification: thickness 0.6mm ~ 6mm
(5) FPC specification: thickness less than 0.6mm (with fixture)
Scope of application
Production and manufacturing of mobile phone, communication, LCD TV, set top box, home theater, vehicle electronics, medical power equipment, aerospace and other products / equipment, and general electronic products production and processing.
Automatic solder paste printing machine was added in Aug 2020
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