Horizon Stannatech - Immersion Tin System

Horizon Stannatech - Immersion Tin System Description:

Perfectly Controlled Immersion Tin System

The Horizon Stannatech system is the leading immersion tin system within the entire PCB industry. Together with the Stannatech process and Atotech's unique Crystallizer and ConStannic control systems for improved stability and process performance the system is the perfect choice for immersion tin for multiple Pb-free soldering and press-fit technology.

With more than 50 installations, the Horizon Stannatech system is the mostly used immersion tin process worldwide.

Stannatech's 0.9 μm pure tin deposit prevents growth of the intermetallic though the tin layer. This ensures perfect performance for multiple soldering even after 12 month storage. Stannatech is ideally suited for SMT and press fit technology where planar and robust surfaces are required. Stannatech is halogen free, wave and multiple reflow capable and compatible to lead free soldering.

Whisker growth is reduced well below IPC's specification with the 'Anti-Whisker Additive' (AWA) and meets demands of the automotive industry. Surface contamination, which is critical for immersion tin baths can be dramatically minimized by using a special process step, Ionix SF. Yellowing of the tin surface due to the harsh during Pb-free soldering in an air environment is avoided with PostDip 270. Ionix SF standard process steps for Stannatech Horizon, whereas PostDip 270 is offered optionally to Stannatech Horizon.