MARCH StratoSPHERE Plasma Treatment System
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MARCH StratoSPHERE Plasma Treatment System |
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MARCH StratoSPHERE Plasma Treatment System Description:
Designed for wafer processing, Nordson MARCH's SPHERE™ series plasma systems, the StratoSPHERE offers superior plasma treatment for high-throughput advanced semiconductor packaging applications.
The StratoSPHERE plasma system is ideal for wafer processing before typical back-end packaging steps, wafer fan out, wafer-level packaging, 3D packaging, flip-chip, and traditional packaging. The system processes up to 300 mm (12 in.) wafers and features a patented plasma chamber that delivers exceptional etch uniformity, process repeatability, cycle-time performance, and minimal cost of ownership.
StratoSPHERE plasma treatment system:
- A three-axis symmetrical chamber ensures uniform treatment of all wafer areas and tight control over process parameters for highly repeatable results.
- Remove contamination before wafer bumping, organic contamination, fluorine and other halogen contamination, and metal and metal oxides.
- Descum wafer of residual photoresist and benzocyclobutene (BCB), pattern dielectric layers for redistribution, strip/etch photoresist, enhance adhesion of wafer applied materials, remove excess wafer-applied mold/epoxy, strengthen the adhesion of gold solder bumps, de-stress wafer to reduce breakage, improve spun-on film adhesion, and clean aluminum bond pads.
MARCH StratoSPHERE Plasma Treatment System was added in Jun 2017
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