SMT Equipment

KY8030-2 3D Solder Paste Inspection System

KY8030-2 3D Solder Paste Inspection System

KY8030-2 3D Solder Paste Inspection System

Name:

KY8030-2 3D Solder Paste Inspection System

Category:

Inspection

Offered by:

Koh Young America, Inc.

Company Information:

Koh Young America, Inc.

Koh Young is the leading True3D™ measurement-based inspection solutions provider supported by its global location network to maintain close communication with a growing user base and provide them access to process experts.

Duluth, Georgia, USA

Consultant / Service Provider, Manufacturer

  • Phone 470-374-9254

Koh Young America, Inc. website

Company Postings:

(6) products in the catalog

(143) news releases

KY8030-2 3D Solder Paste Inspection System Description:

Dual Projection 3D In-Line SPI For High-Volume, Low-Mix Production

The new KY8030-2 delivers 2x faster inspection without compromising performance and accuracy. Using patented dual projection, the system eliminates the critical Shadow problem that all 3D SPI systems can be vulnerable to. Easy UI and SPC Plus are included in the system package in order to help users achieve faster & easier printer process optimization

Key Features:

  • Solution to shadow problem using patented dual projection Moiré technology
  • Industry best inspection speed with guaranteed measurement accuracy
  • Easy UI & SPC Plus included to help printing process optimization

Inspection Items: Volume, Area, Height, Offset, Bridging, Shape Deformity, Coplanarity

Inspection Speed:

Resolution

15um

20um

25um

Inspection time(per FOV)

0.47sec

0.47sec

0.47sec

Max. PCB size:

Machine Size

M

L

XL

Max

330 x 250 mm

510 x 510 mm

810 x 610 mm

Min. PCB size: 50X50mm

KY8030-2 3D Solder Paste Inspection System was added in Jan 2013

KY8030-2 3D Solder Paste Inspection System has been viewed 4631 times

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