SMT Equipment

KY8030-3 3D Solder Paste Inspection System

KY8030-3 3D Solder Paste Inspection System

KY8030-3 3D Solder Paste Inspection System

Name:

KY8030-3 3D Solder Paste Inspection System

Category:

Inspection

Offered by:

Koh Young America, Inc.

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Company Information:

Koh Young America, Inc.

Koh Young is the leading true 3D measurement-based inspection solutions provider supported by its global location network to maintain close communication with a growing user base and provide them access to process experts.

Duluth, Georgia, USA

Inspection, Manufacturer of Test Equipment, Repair / Rework, Test Services

  • Phone 7046512860
  • Fax +1 480 403 5001

Koh Young America, Inc. website

Company Postings:

(6) products in the catalog

(95) news releases

KY8030-3 3D Solder Paste Inspection System Description:

High-speed, High Performance 3D In-Line SPI with Dual Projection

The new KY8030-3 delivers 3x faster inspection without compromising performance and accuracy. Using patented dual projection, the system eliminates the critical Shadow problem that all 3D SPI systems can be vulnerable to. Additionally, the new KY8030-3 has solved the PCB Warp problem that seriously impacts inspection accuracy and reliability of result.

Key Features:

  • Best Inspection Speed without Compromising Accuracy
  • Field Proven Process Optimization
  • Patented Shadow Free Moiré Technology
  • Perfect PCB Warp Compensation

Inspection Items: Volume, Area, Height, Offset, Bridging, Shape Deformity, Coplanarity

Inspection Speed:

Resolution

10um

15um

20um

Inspection time(per FOV)

0.30sec

0.31sec

0.33sec

Max. PCB size:

Machine Size

M

L

XL

Max

330 x 250 mm

510 x 510 mm

810 x 610 mm

Min. PCB size: 50X50mm

View KY8030-3 3D Solder Paste Inspection System

KY8030-3 3D Solder Paste Inspection System was added in Jan 2013

KY8030-3 3D Solder Paste Inspection System has been viewed 3141 times

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