PWB Interconnect Solutions Inc.

PWB designs and manufactures test equipment and provides services to test the reliability of Printed Circuit Boards.

OEM

Our patented Interconnect Stress Test (IST) Technology has the unique ability to identify the presence and severity of post separation of both the Plated-Through Hole (PTH) and Vias within multilayer PCBs. We design and manufacture IST systems, provide IST test services, failure analysis capability, and consulting.

PWB Interconnect Solutions Inc. Postings

3 technical articles »

Dielectric Material Damage Vs. Conductive Anodic Filament Formation

Jul 27, 2021 | Paul Reid

It should be noted that this is an overview paper that represents the early stages of an ongoing investigation into the causes and effects between conductive anodic filament (CAF) formation and printed wiring board (PWB) material damage. Our belief is that certain or specific types of material damage can increase the propensity for CAF formation. The preliminary data collected suggests is that there is no statistical correlation between the general definition of material damage (cohesive failure) and CAF. The resulting dichotomy is that we find no CAF failures in some coupons that have obvious material damage and we find CAF failures in coupons that don't exhibit material damage....

Reliability Testing For Microvias In Printed Wire Boards

Jan 21, 2021 | Bill Birch

Traditional single level microvia structures are generally considered the most robust type of interconnection within a printed wire board (PWB) substrate. The rapid implementation of HDI technology now commonly requires between 2, 3 or 4 levels of microvias sequentially processed into the product. Recent OEM funded reliability testing has confirmed that by increasing the levels (stack height) these structures are proving less reliable, when compared to their single or double level counterparts. Recently false positive results have been recorded on products tested with traditional thermal shock testing methodology (cycling between -40°C and 125°C, or 145°C). A number of companies are incurring product failures resulting in increased costs associated with replacing the circuit boards, components and added labour....

Design and Construction Affects on PWB Reliability

Apr 26, 2012 | Paul Reid

First presented at IPC Apex Expo 2012. The reliability, as tested by thermal cycling, of printed wire boards (PWB) are established by three variables; copper quality, material robustness and design. The copper quality was most influential and could be eva...

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