SMT Equipment

SMT 256 Solder Joint Encapsulant

Company Information:

Yincae Advanced Materials, LLC is a developer, manufacturer, and supplier of high performance coatings, adhesives, electronic and optoelectronic materials.

Albany, New York, USA


  • Phone 5184522880

See Supplier Website »

Company Postings:

(34) products in the catalog

(15) technical library articles

(59) news releases

SMT 256  Solder Joint Encapsulant

SMT 256  Solder Joint Encapsulant


SMT 256 Solder Joint Encapsulant



Offered by:

YINCAE Advanced Materials, LLC.


SMT 256 Solder Joint Encapsulant Description:

World's First Solder Joint Encapsulant

Perfect solution for customers looking to eliminate underfilling processes.

The SMT 256 Individual Solder Joint Encapsulation Adhesive is the world’s first combined flux gel/individual solder joint encapsulation adhesive. The adhesive works like a flux gel but also surrounds the ball with a strong polymer adhesive film and bonds the ball to the component body and PCB without filling all of the space between the balls.

SMT 256 series dip adhesives were designed to enhance solder joint reliability and eliminate solder joint cracking for CSP, BGA, flip chip and PoP, particularly for lead-free applications. SMT 256 can encapsulate the bumps on a component after dipping the component into the adhesive film. The implementation of SMT 256 can improve process yields, eliminating voids and crack in solder joint, removing head-in-pillow issues for large components during the lead-free reflow process.

  • Customer Approved - Billions of Commercial Products use SMT256
  • Enhance Solder Strength 5-10x
  • High Cost Reduction
  • Eliminates Underfill
  • Improves Process Yield
  • Higher Throughput
  • Compatible with Production Lines
  • 100% Reworkability

SMT 256 Solder Joint Encapsulant was added in Oct 2013

SMT 256 Solder Joint Encapsulant has been viewed 750 times

20 More Products from YINCAE Advanced Materials, LLC. :

Facility Closure