SMT Equipment

Qualification of Bare Boards

Company Information:

ACI Technologies, Inc.

ACI, an authorized IPC Training Center operating the National Electronics Manufacturing Center of Excellence providing analytical testing, manufacturing and repair services to the electronics industry.

Philadelphia, Pennsylvania, USA

Consultant, Design, IPC Standards Certification Center, Service Provider, Training Provider

  • Phone 610 362 1200
  • Fax 610 362 1290

ACI Technologies, Inc. website

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(68) upcoming training courses

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Qualification of Bare Boards Description:

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ACI Technologies Inc. - Commercial Services - Engineering, Manufacturing, Analytical and Electronics Manufacturing Training (IPC Certification Training and Custom Electronics Manufacturing Courses)

Qualification of boards and assemblies is the comparison of the board or assembly to an industry standard.

Specifically, we qualify printed circuit boards to IPC-6012 – Qualification and Performance Specifications for Rigid Printed Boards and IPC-A-600 – Acceptability of Printed Circuit Boards, to classes 1,2, and 3. ACIT has the capability to perform PCB qualification including Single Sided Testing and Multilayer and Double sided testing.

In addition to the previously stated qualifications, we can also perform:

  • Visual examination using optical microscopy to study the surface features and finishes
  • X-ray fluorescence (XRF) spectroscopy for thickness measurements of surface finishes
  • Micro-sectioning the board and evaluating the internal construction, and Scanning
  • Electron microscopy with energy dispersive X-ray spectroscopy (SEM-EDS) to examine the elemental composition of features along with high magnification imaging

PCB Qualification includes:

Single Sided Testing

  • Visual Inspection - IPC 600 Rev G (Class 2) and IPC 6012 Section 3.3 Visual Examination
  • Ionic Cleanliness Testing as per IPC TM-650 2.3.25.1 (Dynamic ROSE Test (Ionograph))
  • Hole Size Measurement as per IPC TM-650 2.2.6 & 2.2.7
  • Bow & Twist Evaluation as per IPC TM-650 2.4.22
  • Adhesion/Tape Test as per IPC TM-650 2.4.1
  • Land Bond Strength, Unsupported holes as per IPC TM-650 2.4.21
  • PWB Solderability Assessment as per J-STD-003 4.2.3 Test C (tin-lead) or Test C1 (lead free) after steam aging for 8 hrs

Multi Layer and Double Sided Testing

  • Visual Inspection - IPC 600 Rev G (Class 2) and IPC 6012 Section 3.3 Visual Examination
  • Thermal Stress as per IPC TM-650 2.6.8
  • Ionic Cleanliness Testing as per IPC TM-650 2.3.25.1 (Dynamic ROSE Test (Ionograph))
  • Hole Size Measurement as per IPC TM-650 2.2.6 & 2.2.7
  • Bow & Twist Evaluation as per IPC TM-650 2.4.22
  • Adhesion/Tape Test as per IPC TM-650 2.4.1
  • Rework Simulation/ Unsupported Holes as per IPC TM-650 2.4.3
  • Dimensional Inspection w/Micro section as per IPC-TM-650 2.2.5
  • PWB Solderability Assessment as per J-STD-003 4.2.3 Test C (tin-lead) or Test C1 (lead free) after steam aging for 8 hrs

We have staff members that are master and certified instructors for IPC A 600.

View Qualification of Bare Boards on ACI Technologies, Inc. website

Qualification of Bare Boards was added in May 2019

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