Rogers Corporation

Rogers' high performance laminates and bondplies are engineered to meet stringent customer requirements for 5G wireless communication, wired infrastructure, automotive radar sensors, aerospace, satellites and more.

Manufacturer of Assembly Material, Laminates

What We Make

We manufacture high frequency laminates for applications in the wireless base station, aerospace and defense, automotive, high-speed digital and advanced chip packaging industries. All of our products are manufactured in an ISO-9001:2008 certified facility with "ahead of the curve" process technology.

Our Customers

Our customers include Original Equipment Manufacturers (OEM) and printed circuit board fabricators (from quick-turn prototype shops to high volume corporations) for advanced electronic applications. We serve customers around the globe with manufacturing facilities and customer support in Asia, Europe, and North America.

How We Work with You

We work closely with your product designers to anticipate rapidly changing needs and technological advances, and we manufacture products to your exact performance requirements. Then we provide all the necessary training and technical support to ensure that our materials work perfectly in your processes. We are committed to helping you to meet intense competition with unique high-performance solutions.

Rogers Corporation Postings

4 products »

RO4000® Series High Frequency Circuit Materials

Woven Glass Reinforced, Ceramic Filled Thermoset Rogers RO4000® high frequency circuit materials are glass-reinforced hydrocarbon/ceramic laminates-not PTFE. They combine high frequency performance comparable to ...

Materials

RO4000® Series High Frequency Circuit Materials

2929 Bondply - Advanced Circuit Laminate

2929 bondply is an unreinforced hydrocarbon based thin film adhesive system intended for use in high performance, high reliability multi-layer constructions.  A low dielectric constant (2.9) and loss tangent (<0.003) at microwave freque...

Materials

2929 Bondply - Advanced Circuit Laminate

Kappa® 438 Laminates

Kappa(R) 438 thermoset laminates are glass reinforced hydrocarbon materials, developed for wireless circuit designers looking for a better performing and more reliable alternative to FR-4 laminates....

Materials

Kappa® 438 Laminates

RO3000® Series High Frequency Laminates

RO3000® high frequency circuit materials are ceramic-filled PTFE composites intended for use in commercial microwave and RF applications. This family of products was designed to offer exceptional electrical and mechanical stability.&...

Materials

RO3000® Series High Frequency Laminates

5 technical articles »

Selection of PCB Materials for 5G

Aug 05, 2020 | John Coonrod

With the first 5G NR standard recently approved by the 3GPP at the end of 2017, many companies are racing to design 5G radio products that will demand wider bandwidths, higher frequencies, enhanced carrier aggregation and support of massive MIMO. AT&T and Samsung plan to launch 5G mobile services and Verizon plans to launch 5G Fixed Wireless Access in the US this year while South Korea will be demonstrating 5G at the upcoming Winter Olympics....

Understanding Circuit Material Performance Concerns for PCBs at Millimeter-Wave Frequencies

Apr 11, 2018 | John Coonrod

Millimeter-wave (mmWave) frequency applications are becoming more common. There are applications utilizing PCB technology at 60 GHz, 77 GHz and many other mmWave frequencies. When designing a PCB for mmWave frequency, the properties of the circuit materials need to be considered since they can be critical to the success of the application. Understanding the properties of circuit materials at these frequencies is very important.

This paper will give an overview of which circuit material properties are important to mmWave frequency applications using PCBs. There will be data supplied which demonstrates why these properties are essential to the circuit material selection for mmWave applications. Some properties discussed will be dielectric constant (Dk) control, dissipation factor, moisture absorption, thickness control and TCDk (Temperature Coefficient of Dk). Measured comparisons will be shown for insertion loss and Dk versus frequency for different types of circuit materials up to 110 GHz. As part of the test data, the impact on circuit performance due to TCDk and moisture absorption will be shown at mmWave frequencies....

The Effects of PCB Fabrication on High-Frequency Electrical Performance

Jul 21, 2016 | John Coonrod

Achieving optimum high-frequency printed-circuit-board (PCB) performance is not simply a matter of specifying the best possible PCB material, but can be significantly impacted by PCB fabrication practices. In addition to appropriate circuit materials and circuit design configurations to meet target performance goals, a number of PCB material-related issues can affect final performance, including the use of soldermask, the PCB copper plating thickness, the conductor trapezoidal effect, and plating finish; understanding the effects of these material issues can help when fabricating high-frequency circuits for the best possible electrical performance....

New Developments in PCB Laminates

Jul 19, 2012 | Dean Hattula, John Coonrod

First published in the 2012 IPC APEX EXPO technical conference proceedings. With the ever accelerating demands in printed circuit board (PCB) design, the choices of advanced laminate materials have become fewer and fewer. The trends continue towards high...

Thermal Characteristics of PCB Laminates used in High Frequency Applications

Jul 11, 2012 | John Coonrod

As technology advances, understanding thermal management issues of high frequency PCB's increases. There are many different aspects to consider for PCB thermal management. This paper will investigate thermal management issues of high frequency PCB's as it...

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