Kapp Copper-Bond Flux 500°F - 750°F (260°C - 390°C)

Kapp Copper-Bond Flux 500°F - 750°F (260°C - 390°C) Description:

Flux designed specifically to work with KappZapp7, 7.0% Silver solder to remove the oxide layer on Copper to allow a strong metallic bond between the solder and the base metal. Its active range is 500°F - 750°F (260°C - 390°C). Kapp Copper-Bond Flux has been designed for high temperature soldering of all common metals except Aluminum. Kapp Copper-Bond Flux is an activated liquid flux containing a mixture of inorganic salts in water, with approximately 50% active ingredients.

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