Printed Circuit Board

Printed Circuit Board Description:

Layer: 8 layers
Material: FR-4
Board Thickness: 0.6mm
Surface Finish: Immersion Gold 1~4u
Copper Thickness: 1/3 oz
Impedance, 4/4mils width/spacing
Layers: 2--36layers
Max manufacturing size: 640mm*1100mm
Copper foil thickness:  0.5OZ-13OZ
Min line width/space:   3mil/3mil
Min finished holes size: 0.15mm
Aspect ratio: 12:1
Impedance control: +/-10%
Surface treatment: HASL；HASL with Pb free
Immersion Gold; Immersion Tin; Immersion Silver
Gold Finger; Flash Gold; OSP
Materials: FR4, Tg: 130℃/170℃,Rogers,Arlon,Taconic
Bergquist, Thermagon,
Special technique: blind&buried holes, via in pad,
Semi-plating holes, countersinked holes,
Step mounting holes, controlled depth holes
Edge-plating PCB and metal base PCB