X2.5L Automated X-Ray System for High-speed Final Inspection
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X2.5L Automated X-Ray System for High-speed Final Inspection |
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X2.5L Automated X-Ray System for High-speed Final Inspection Description:
Automated inspection system designed for high-speed final inspection of printed circuit boards and complete assemblies.
The X2.5L is based on the well-established MatriX X2.5 system series. It is configured with a new generation of TDI X-ray cameras providing high speed, high sensitivity and high resolution. The configuration of the X2.5L allows the inspection of complete PCBs with only a few scans. In addition the MatriX X2.5L is equipped with one additional CMOS x-ray detector on an independent U/V stage. This allows high-speed off-axis image acquisition from different angles and directions with maximum image quality and resolution.
X-ray system features
- High Speed AXI System up to 400 mm/sec (Line Scan)
- Wide angle microfocus X-Ray (sealed), 130 kV/40 W
- High-speed readout TDI camera (Line Scanner)
- Scan width up to 100 mm
- Additional CMOS X-Ray detector (12 x 7cm, 14 bit digital output, 2k x 2k)
- 5-axes programmable motion system with X/Y sample table and CMOS detector on U/V motion axis
- Automatic grey-level and geometrical calibration
- Barcode scanner (1D/2D) for serial number and product type selection
Applications
- All standard SMDs and THT/PTH components
- Specific BGA and QFN algorithm
- Off-axis image analysis of e.g. BGA, THT
- Cooling plates/heatsink void inspection
- Assembly Completion Test
- Final Production Quality Test
X2.5L Automated X-Ray System for High-speed Final Inspection was added in Jan 2016
X2.5L Automated X-Ray System for High-speed Final Inspection has been viewed 801 times
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