Ormet Circuits, Inc.

Manufacturer of sintering, electrically conductive materials. Applications include semiconductor die attach, component attach, via fill, z-axis interconnection, conductive lines and traces and plated-through hole fill.

Manufacturer of Assembly Material

Ormet conductive materials are surging into wide use in many electronic applications. From radar antennas to semiconductor packages, complex circuit boards to electronic components and assemblies, the products are finding uses visualized for them after their discovery in the late 1990`s and suggested in exciting technical reports over time.

Ormet`s lead free conductive pastes, based on a technology called Transient Liquid Phase Sintering (TLPS) have been developed over a number of years. Applications are found in semiconductor packaging, die attach, printed circuit boards, photovoltaics, lead free solder replacement, and electro-magnetic shielding. Focused in the early years on Military/Aerospace applications, the material has been thoroughly qualified through exhaustive testing at major companies such as Boeing and Raytheon. Ormet`s material technology and associated applications, are covered by a solid body of intellectual property with 24 issued patents.

Founded in 2001, Ormet has distribution and representative organizations throughout the world.

Ormet Circuits, Inc. Postings

1 technical article »

PTH Core-to-Core Interconnect Using Sintered Conductive Pastes

Mar 07, 2013 | Michael Matthews, Ken Holcomb, Jim Haley, Catherine Shearer

The market for high-layer-count printed circuit boards (PCB) containing blind and buried vias was once relatively small, and focused on specialized applications in the military and high end computing. The demand for these types of PCBs today is being driven by an increasing number of commercial applications in the telecommunications and semiconductor test market segments. These applications typically require high-aspect-ratio plated-through-holes (PTHs) and blind and buried vias in order to meet the applications interconnect density requirements. Blind and buried vias and high aspect ratio PTHs continue to present manufacturing challenges and frequently are the limiting features to achieving high fabrication yield... First published in the 2012 IPC APEX EXPO technical conference proceedings...

2 news releases »

Ormet Circuits Inc. introduces new Transient Liquid Phase Sintering Paste

Nov 10, 2020 | Ormet Circuits Inc. announced the introduction of its new Ormet® DAP-491-1 Transient Liquid Phase Sintering (TLPS) paste. TLPSpastes are lead-free and high-temperature stable sintering solder systems for semiconductor packaging and assembly.

Ormet Circuits Inc. Awarded for New Transient Liquid Phase Sintering Paste

Oct 29, 2020 | Ormet Circuits Inc. received a 2020 Mexico Technology Award in the category of Thermal Interface Materials for its Ormet® DAP-491-1 TLPS paste. The award was announced during a Virtual Awards Ceremony onMonday, October 26, 2020.

Capillary Underfill process

Conformal Coating Machine under 40000