Assembly Process Technologies LLC

With over 20 years of experience in the electronic and semiconductor assembly design, we offer rapid prototypes for R&D or New Product Introduction.

Service Provider

Assembly Process Technologies LLC offer a wide range of professional engineering services, from process characterization/optimization, to custom built automated solutions for your assembly requirements.

If you are just doing some R&D for New Product Introduction, or require some tooled items to integrate and enhance your current assembly operation, we can assist.

Your time is best devoted to your core business. Contact us for a consultation on how we can become your technology partner and assist you and your business.

Services Offered:

  • Consulting services.
  • Engineering Design Services using state of the art 3D modeling
  • Fabrication and Equipment Assembly
  • Rapid Prototypes
  • Process Characterization/Optimization

Assembly Process Technologies LLC Postings

1 technical article »

Low Surface Energy Coatings Rewrites the Area Ratio Rules

Jun 20, 2013 | Ricky Bennett; Assembly Process Technologies, Eric Hanson; Aculon

With today's consumer technologies driving the need for denser and more compact devices, the assembly process for surface mounted devices has becoming increasingly more difficult. With the mixture of components requiring a broader range of print deposition volume, various techniques are in use in an attempt to ensure consistent and appropriate paste volume is achieved. Some of these techniques include step etching a stencil locally on a targeted device, promoting electroformed smooth wall nickel stencils, through to laser cutting newer grade stencil materials. This paper focuses on the relevant attributes that affect the properties of solder paste release and introduces the effects of surface free energy with respect to key elements that make up the stencil printing process....

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