WE GOT Electronic Co., Ltd

Thermal conductivity materials

Other, OEM

Today's electronic products have a high processing speed, the need for a larger and more efficient way to manage the heat.
Thermally conductive material is used to fill the gap between the heat sink and microprocessor. Improper selection of thermal conductivity materials, may damage the product life cycle. Wei Jia thermal conductivity material series provides solutions to maintain the excellent thermal conductivity.
Thermal pads used in various electronic applications and industries, including computers, laptops, tablet PCs, smart phones, routers, LED, solar energy, medical equipment, power supply, wireless devices, and automotive industries.
Our team give you the most professional service, giving you a high C / P value of the material, we have bases in Dongguan and Kunshan, fast delivery and service

WE GOT Electronic Co., Ltd Postings

10 products »

Common type electronic automatic foot feeder

DIP automatic scissors feeder   Product Description: Before the industry in the DIP (traditional parts plug-in) process mostly belong to the majority of human work Procut device can replace the current DIP (traditi...

Components

Common type electronic automatic foot feeder

Copper Foil Composite Materia

Typical Applications 1.microprocessors and cache chips 2.aptop PCs and other high density, handheld portable electronics 3.high speed disk drives Features/Benefits 1.component junction temperature redu...

Other

Copper Foil Composite Materia

Copper Foil Composite Materia

Typical Applications 1.microprocessors and cache chips 2.aptop PCs and other high density, handheld portable electronics 3.high speed disk drives Features/Benefits 1.component junction temperature redu...

Other

Copper Foil Composite Materia

Typical Applications 1.microprocessors and cache chips 2.aptop PCs and other high density, handheld portable electronics 3.high speed disk drives Features/Benefits 1.component junction temperature redu...

Other

Copper Foil Composite Materia

Typical Applications 1.microprocessors and cache chips 2.aptop PCs and other high density, handheld portable electronics 3.high speed disk drives Features/Benefits 1.component junction temperature redu...

Other

Copper Foil Composite Materia

Typical Applications 1.microprocessors and cache chips 2.aptop PCs and other high density, handheld portable electronics 3.high speed disk drives Features/Benefits 1.component junction temperature redu...

Other

Copper Foil Composite Materia

Typical Applications 1.microprocessors and cache chips 2.aptop PCs and other high density, handheld portable electronics 3.high speed disk drives Features/Benefits 1.component junction temperature redu...

Other

Thermally Conductive Adhesive Double Tape

Product Description Thermally Conductive Adhesive Transfer Tapes 5715 is designed to provide a heat-transfer path between heat-generating components and heat sinks or other cooling devices, it can be used to seal gaps among PCBs, heat d...

Other

Thermally Conductive Adhesive Double Tape

Thermal Phase Change Pad

PCH-S15 Series thermally conductive interface materialsare applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very u...

Other

Thermal Phase Change Pad

Thermal pads

M400 Series thermallyconductive interface materials are applied to fill the air gaps between the heatingelements and the heat dissipation fins or the metal base. Their flexibility andelasticity make them suited to the coating of the very uneven...

Other

Thermal pads
Conformal Coating Machine under 40000

Flux-Free Reflow Soldering