SMT Equipment

Flip Chip Bonder Packaging System

Company Information:

X-ray|LINAC|SEM(Scanning Electron Microscope)|PKG System

Suwon, South Korea

Manufacturer

  • Phone +82-31-215-7341

See Supplier Website »

Company Postings:

(12) products in the catalog

(6) news releases

Flip Chip Bonder Packaging System

Flip Chip Bonder Packaging System

Name:

Flip Chip Bonder Packaging System

Category:

Assembly Services

Offered by:

SEC

   

Flip Chip Bonder Packaging System Description:

Packaging System for Semiconductor and Electronic Device

Flip Chip Bonder is an equipment used in the semiconductor packaging process.
It is a method of connecting individual chips of wafers so that the bumps on the chip and electrodes of the substrate face each other, and unlike conventional wire bonding, the bump arrangement of chips and electrode arrangement of substrates are matched 1:1.
Compared to wire bonding, the field area and height are small, so it is advantageous for small and thin shapes and has excellent electrical characteristics due to minimizing signal length by 1:1 matching. Due to these advantages and technical requirements, it is used in markets such as TV, Mobile, CMOS, RF TAG, and MEMS as a technology that can respond to micro-pitch, 2.5D, and 3D packages.

FCB300+ Chip on Film

  • High Speed & High Precision
  • Over 17years of Experience & Know-how
  • Vision Alignment & Image Process
  • Motion & Force Control
  • 12-inch Wafer Handling

FCB300CS for Chip to Substrate

  • Various Application Flexibility
  • High Precision
  • Over 17years of Experience & Know-how
  • Vision Alignment & Image Process
  • Motion & Force Control
  • 12-inch Wafer Handling

Flip Chip Bonder Packaging System was added in Aug 2020

Flip Chip Bonder Packaging System has been viewed 101 times

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