Advanced Surface Finishes For Electronic Devices
MacDermid Electronics Solutions is a leading supplier of specialty chemicals for fabricators, assemblers, and original equipment manufacturers. We are a proven innovator in the field of electronics processing, with a passion for providing application-specific solutions for our customers' most difficult manufacturing challenges and unsurpassed technical support.
For over 80 years, we have made satisfying the innovation and service needs of customers our first priority, and this dedication has enabled us to be specified by more companies every year.
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Jul 17, 2019 | Maria Nikolova, Confesol Rodriguez, Kesheng Feng, Carmichael Gugliotti, William Bowerman, Jim Watkowski, Bob Wei
The increased demand for electronic devices in recent years has led to an extensive research in the field to meet the requirements of the industry. Electrolytic copper has been an important technology in the fabrication of PCBs and semiconductors. Aqueous sulfuric acid baths are explored for filling or building up with copper structures like blind micro vias (BMV), trenches, through holes (TH), and pillar bumps. As circuit miniaturization continues, developing a process that simultaneously fills vias and plates TH with various sizes and aspect ratios, while minimizing the surface copper thickness is critical. Filling BMV and plating TH at the same time, presents great difficulties for the PCB manufactures. The conventional copper plating processes that provide good via fill and leveling of the deposit tend to worsen the throwing power (TP) of the electroplating bath. TP is defined as the ratio of the deposit copper thickness in the center of the through hole to its thickness at the surface.</p> <p>In this paper an optimization of recently developed innovative, one step acid copper plating technology for filling vias with a minimal surface thickness and plating through holes is presented....
Jun 26, 2019 | Saminda Dharmarathna, Christian Rietmann, William Bowerman, Kesheng Feng, Jim Watkowski
Copper-filled micro-vias are a key technology in high density interconnect (HDI) designs that have enabled increasing miniaturization and densification of printed circuit boards for the next generation of electronic products. Compared with standard plated through holes (PTHs) copper filled vias provide greater design flexibility, improved signal performance, and can potentially help reduce layer count, thus reducing cost. Considering these advantages, there are strong incentives to optimize the via filling process. This paper presents an innovative DC acid copper via fill formulation, for VCP (Vertical Continues Plating) applications which rapidly fills vias while minimizing surface plating....
Oct 31, 2018 | Saminda Dharmarathna, PhD, Ivan Li, PhD, Maddux Sy, Eileen Zeng, Bob Wei, William Bowerman, Kesheng Feng, PhD
The electronics industry has grown immensely over the last few decades owing to the rapid growth of consumer electronics in the modern world. New formulations are essential to fit the needs of manufacturing printed circuit boards and semiconductors. Copper electrolytes for high throwing power applications with high thermal reliability and high throughput are becoming extremely important for manufacturing high aspect ratio circuit boards.
Here we discuss innovative DC copper metallization formulations for hoist lines and VCP (Vertical Continues Plating) applications with high thermal reliability and throughput for high aspect ratio PCB manufacturing...
Apr 18, 2018 | Fei Peng, Naomi Ando, Roger Bernards, Bill Decesare
Higher functionality, higher performance and higher reliability with smaller real estate are the mantras of any electronic device and the future guarantees more of the same. In order to achieve the requirements of these devices, designs must incorporate fine line and via pitch while maintain good circuitry adhesion at a smooth plating-resin interface to improve signal integrity. The Semi-Additive Process (SAP) is a production-proven method used on low dielectric loss tangent (Df) build-up materials that enables the manufacture of ultra-fine circuitry. (...)
This paper will discuss a new SAP process for low loss build-up materials with low desmear roughness (Ra= 40-100 nm) and excellent adhesion (610-680 gf/cm) at various processing conditions. Along with the process flow, the current work will also present results and a discussion regarding characterization on the morphology and composition of resin and/or metal plating surfaces using scanning electron microscopy (SEM) and energy dispersive X-ray spectroscopy (EDX), surface roughness analysis, plating-resin adhesion evaluation from 90o peel tests...
Aug 02, 2017 | Rita Mohanty
In this rapidly moving electronics market, fast to market with new products is what separates top performing companies from average companies. A survey conducted by Arthur D. Little revealed that "New-Product Development (NPD) productivity in atop performing company is five times what it is in the average company. The top performer gets five times as much new product output for the same investment." What do they know that the rest of us do not? One winning factor is the use of the Robert Cooper process. (...)
This paper will present a Lean Six Sigma approach to "right sizing" the Stage Gate process to be efficient, practical, and easy to manage. Various tools of Stage Gate, along with proven best practice, will be covered. In addition, a reduced Stage Gate model will be discussed for simple, low risk projects....
Jun 22, 2015 | Jun Nable, Ph.D., MacDermid Inc. Waterbury, CT
Surface finishing is an integral part of any PCB fabrication. It is generally applied to exposed Cu connectors and conductors on the board. Surface finishing has numerous important functions. It serves as a protective layer for the Cu connectors during storage. The surface finish helps minimize or reduce tarnish of the Cu substrate. Additionally, since it is the layer that comes into contact with other components during assembly, it ensures good solderability between the PCB and the component during assembly. Furthermore after assembly, the finish helps prolong the integrity of the solder joint during use.
A general review of common PCB surface finishes is presented. The advantages and disadvantages of each are discussed and compared. ...