MacDermid Inc.

MacDermid is a global provider of specialty chemicals for the most complex printed circuit board designs. We specialize in the areas of final finishes, through-hole metallization, and circuit formation.

Manufacturer of Assembly Material, Antistatic

Advanced Surface Finishes For Electronic Devices

MacDermid Electronics Solutions is a leading supplier of specialty chemicals for fabricators, assemblers, and original equipment manufacturers. We are a proven innovator in the field of electronics processing, with a passion for providing application-specific solutions for our customers' most difficult manufacturing challenges and unsurpassed technical support.

For over 80 years, we have made satisfying the innovation and service needs of customers our first priority, and this dedication has enabled us to be specified by more companies every year.

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4 technical articles »

High Throw DC Acid Copper Formulation for Vertical Continuous Electroplating Processes

Oct 31, 2018 | Saminda Dharmarathna, PhD, Ivan Li, PhD, Maddux Sy, Eileen Zeng, Bob Wei, William Bowerman, Kesheng Feng, PhD

The electronics industry has grown immensely over the last few decades owing to the rapid growth of consumer electronics in the modern world. New formulations are essential to fit the needs of manufacturing printed circuit boards and semiconductors. Copper electrolytes for high throwing power applications with high thermal reliability and high throughput are becoming extremely important for manufacturing high aspect ratio circuit boards.

Here we discuss innovative DC copper metallization formulations for hoist lines and VCP (Vertical Continues Plating) applications with high thermal reliability and throughput for high aspect ratio PCB manufacturing...

Semi-Additive Process for Low Loss Build-Up Material in High Frequency Signal Transmission Substrates

Apr 18, 2018 | Fei Peng, Naomi Ando, Roger Bernards, Bill Decesare

Higher functionality, higher performance and higher reliability with smaller real estate are the mantras of any electronic device and the future guarantees more of the same. In order to achieve the requirements of these devices, designs must incorporate fine line and via pitch while maintain good circuitry adhesion at a smooth plating-resin interface to improve signal integrity. The Semi-Additive Process (SAP) is a production-proven method used on low dielectric loss tangent (Df) build-up materials that enables the manufacture of ultra-fine circuitry. (...)

This paper will discuss a new SAP process for low loss build-up materials with low desmear roughness (Ra= 40-100 nm) and excellent adhesion (610-680 gf/cm) at various processing conditions. Along with the process flow, the current work will also present results and a discussion regarding characterization on the morphology and composition of resin and/or metal plating surfaces using scanning electron microscopy (SEM) and energy dispersive X-ray spectroscopy (EDX), surface roughness analysis, plating-resin adhesion evaluation from 90o peel tests...

Lean Six Sigma Approach to New Product Development

Aug 02, 2017 | Rita Mohanty

In this rapidly moving electronics market, fast to market with new products is what separates top performing companies from average companies. A survey conducted by Arthur D. Little revealed that "New-Product Development (NPD) productivity in atop performing company is five times what it is in the average company. The top performer gets five times as much new product output for the same investment." What do they know that the rest of us do not? One winning factor is the use of the Robert Cooper process. (...)

This paper will present a Lean Six Sigma approach to "right sizing" the Stage Gate process to be efficient, practical, and easy to manage. Various tools of Stage Gate, along with proven best practice, will be covered. In addition, a reduced Stage Gate model will be discussed for simple, low risk projects....

PCB Surface Finishes: A General Review

Jun 22, 2015 | Jun Nable, Ph.D., MacDermid Inc. Waterbury, CT

Surface finishing is an integral part of any PCB fabrication. It is generally applied to exposed Cu connectors and conductors on the board. Surface finishing has numerous important functions. It serves as a protective layer for the Cu connectors during storage. The surface finish helps minimize or reduce tarnish of the Cu substrate. Additionally, since it is the layer that comes into contact with other components during assembly, it ensures good solderability between the PCB and the component during assembly. Furthermore after assembly, the finish helps prolong the integrity of the solder joint during use.

A general review of common PCB surface finishes is presented. The advantages and disadvantages of each are discussed and compared. ...

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